Specific Process Knowledge/Lithography/Descum: Difference between revisions
No edit summary |
|||
| Line 37: | Line 37: | ||
Conny Hjort & Jesper Hanberg | Conny Hjort & Jesper Hanberg | ||
September 2019 | September 2019 | ||
Descum of different resists, AZ5214E, AZ701 MiR and AZ2020 nLOF, on a single 100mm wafer was tested. Wafer was placed vertically in the middle of glass carrier. | |||
Recipe setting was the same as in previous test in September 2019: 70ml/min O2, 70 ml/min N2, power 150W, different ashing time 1, 2, 3, 5 and 7 min run. Plasma Asher was cold before use, we observed minor temperature rise during processing, but not more than 5 degrees. Starting chambers pressure was around 0, 5 mbar. | |||