Specific Process Knowledge/Characterization/XPS/Nexsa: Difference between revisions
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*[[Specific Process Knowledge/Characterization/XPS/Raman|Raman spectroscopy]] | *[[Specific Process Knowledge/Characterization/XPS/Raman|Raman spectroscopy]] | ||
*[[Specific Process Knowledge/Characterization/XPS/UPS technique|Ultraviolet Photoelectron Spectroscopy or UPS)]] | *[[Specific Process Knowledge/Characterization/XPS/UPS technique|Ultraviolet Photoelectron Spectroscopy or UPS)]] | ||
== Getting access to the XPS == | |||
Click [[Specific Process Knowledge/Characterization/XPS/Access | '''HERE''' ]] to see information on how to get access to the XPS. | |||
== Performance of XPS Nexsa == | |||
{| border="2" cellspacing="0" cellpadding="1" |- | |||
!style="background:silver; color:black;" align="left"|Purpose | |||
|style="background:LightGrey; color:black"|Chemical analysis | |||
|style="background:WhiteSmoke; color:black"| | |||
* [[Specific Process Knowledge/Characterization/XPS/XPS elemental composition|Probing elemental composition]] | |||
* [[Specific Process Knowledge/Characterization/XPS/XPS Chemical states |Chemical state identification]] | |||
* Non destructive technique | |||
* Surface sensitive | |||
* [[Specific Process Knowledge/Characterization/XPS/XPS Depth profiling|Depth profiling]] possible by ion beam etch of sample | |||
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!rowspan="5" style="background:silver; color:black" align="left"| Performance | |||
|style="background:LightGrey; color:black"|Spot size | |||
|style="background:WhiteSmoke; color:black"|Can be set between 30µm - 400µm | |||
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|style="background:LightGrey; color:black"|Probing depth | |||
|style="background:WhiteSmoke; color:black"|Depending on probed element. Max probe depth lies within 10-200 Å. | |||
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|style="background:LightGrey; color:black"|Resolution | |||
|style="background:WhiteSmoke; color:black"|Dependent on probed elements. Concentrations down to about 0,5 atomic % can in some cases be detected. | |||
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|style="background:LightGrey; color:black"|Charge compensation | |||
|style="background:WhiteSmoke; color:black"| | |||
Flood gun can be used for charge compensation of non conductive samples | |||
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|style="background:LightGrey; color:black"|Finding structures | |||
|style="background:WhiteSmoke; color:black"|Choose measuring spot from camera image (magnified) | |||
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!rowspan="2" style="background:silver; color:black" align="left"|Depth profiling | |||
|style="background:LightGrey; color:black"|Purpose | |||
|style="background:WhiteSmoke; color:black"|With ion beam etch the top layer of the material can be removed, to do a depth profiling | |||
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|style="background:LightGrey; color:black"|Ion beam size | |||
|style="background:WhiteSmoke; color:black"| About 3x1 mm | |||
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!rowspan="2" style="background:silver; color:black" align="left"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
|style="background:WhiteSmoke; color:black"| | |||
Maximum 60x60 mm | |||
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| style="background:LightGrey; color:black"|Substrate thickness | |||
|style="background:WhiteSmoke; color:black"| | |||
Maximum height about 20 mm | |||
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|} | |||
== Thermofisher sales documents == | == Thermofisher sales documents == | ||
*[https://assets.thermofisher.com/TFS-Assets/MSD/brochures/BR52913-EN-Nexsa-XPS-Brochure.pdf Nexsa Surface Analysis System] | *[https://assets.thermofisher.com/TFS-Assets/MSD/brochures/BR52913-EN-Nexsa-XPS-Brochure.pdf Nexsa Surface Analysis System] | ||