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SU-8 resist is designed to produce low defect coatings over a very broad range of films thickness.  
SU-8 resist is designed to produce low defect coatings over a very broad range of films thickness.  


[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]] is dedicated to spin all SU-8 resist formulations, but [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Manual All Resist]] can also be used.
[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]] is dedicated to spin all SU-8 resist formulations, but one of the [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|manual spin coaters]] can also be used.


To keep clean room safe and odor free during the spinning please follow the following simple rules:
To keep clean room safe and odor free during the spinning please follow the following simple rules:
* Always use point exhaust above the place you handle the resist.
* Always use point exhaust above the place you handle the resist.
* To minimize fumes of resist keep the wafers with resist in the extract box prior the baking.
* When you move the wafers to the dedicated hot plates always carry them in a closed container.
[[Image:KS_Spinner_extract_box.png|500x500px|thumb|Extract box for unbaked wafers.]]
* When you move the wafers to the dedicated hot plates always carry them in a close container.


The recommended coating condition:
The recommended coating condition:
* Do manual syringe dispense for the thin resists or use a syringe dispense system for the thick resists.
* Dispense manually from bottle/syringe for the thin resists or use a syringe dispense system for the thick resists.
* Do static dispense: approximately 1 ml of SU-8 per inch substrate diameter.  
* Use static dispense; approximately 1 ml of SU-8 per inch substrate diameter.  
* For SU-8 layers thicker then 100 um use two/step spin coating procedure:
* For SU-8 layers thicker then 100 um use two/step spin coating procedure:
** spread cycle 500rpm, 100rpm/s, 5 sec following by  
** spread cycle 500rpm, 100rpm/s, 5 sec following by  
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* For SU-8 layers thinner then 10um the spread cycle can be omitted to improve the uniformity of the films.
* For SU-8 layers thinner then 10um the spread cycle can be omitted to improve the uniformity of the films.


Here are the spinning curves for SU-8 2002 and SU-8 2005.
Here are the spinning curves for SU-8 2002 and SU-8 2005 (for the old KS Spinner).
[[media:Spinning_curves.xls|Spinning curves for SU-8 2002 and 2005.]]
[[media:Spinning_curves.xls|Spinning curves for SU-8 2002 and 2005.]]


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