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Specific Process Knowledge/Thin film deposition/ALD Picosun R200: Difference between revisions

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=ALD Picosun 200=
=ALD1=


'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/ALD_Picosun_R200 click here]'''
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/ALD_Picosun_R200 click here]'''
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== ALD - Atomic layer deposition ==
== ALD - Atomic layer deposition ==
[[image:ALD.jpg|300x300px|right|thumb|Picosun R200 ALD, positioned in cleanroom F-2.]]
[[image:ALD.jpg|300x300px|right|thumb|ALD1, positioned in cleanroom F-2.]]


The Picosun R200 ALD (atomic layer deposition) tool is used to deposit a very thin layer of Al<sub>2</sub>O<sub>3</sub>, TiO<sub>2</sub> (amorphous or anatase) and ZnO on different samples.  
The ALD1 (Picosun R200 ALD) tool is used to deposit a very thin layer of Al<sub>2</sub>O<sub>3</sub>, TiO<sub>2</sub> (amorphous or anatase) and ZnO on different samples.  


Each process is using two different precursors. The reaction takes place in cycles. During each cycle, a very short pulse of each precursor is introduced into the ALD reaction chamber in turns, and in-between each precursor pulse the chamber is purged with nitrogen. All reactions have to take place on the sample surface, thus it is very important that each precursor is removed from the chamber before the next one is introduced. In that way, the ALD layer will be deposited atomic layer by atomic layer.  
Each process is using two different precursors. The reaction takes place in cycles. During each cycle, a very short pulse of each precursor is introduced into the ALD reaction chamber in turns, and in-between each precursor pulse the chamber is purged with nitrogen. All reactions have to take place on the sample surface, thus it is very important that each precursor is removed from the chamber before the next one is introduced. In that way, the ALD layer will be deposited atomic layer by atomic layer.  
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'''The user manual, the user APV and contact information can be found in LabManager:'''
'''The user manual, the user APV and contact information can be found in LabManager:'''


[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=321 ALD Picosun R200 info page in LabManager],
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=321 ALD1 info page in LabManager],


== Process information ==
== Process information ==
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>ALD Picosun R200</b>
|style="background:WhiteSmoke; color:black"|<b>ALD1</b>
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!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose