Specific Process Knowledge/Thin film deposition/Sputter coater: Difference between revisions

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*Not measured
*Not measured
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*0.01 mbar
*0.01 mbar
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*Gold sputter coating of different samples before SEM characterization
*Maximum 30 s
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates

Revision as of 09:16, 23 September 2016

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The Hummer Sputter coater

The Hummer sputter coater located in service area Cx1

The Hummer sputter coater is used to sputter a thin gold layer on different small samples (up to 100 mm wafers).

One of the most effective ways to counter the problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The Hummer sputter coater is an instrument that allows you to coat small samples with a gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps the gold layer will effectively eliminate all charging problems in the SEM.

The Hummer sputter coater is located in servie area Cx1 in the clearoom.

The user manual and contact information can be found in LabManager:

Hummer sputter coater

Process knowledge

Overview of the performance of the Hummer sputter coater and some process related parameters

Purpose
  • Gold sputter coating of different samples mainly before SEM characterization (see purpose)
Performance Film thickness
  • 10 Å - ?
Deposition rate
  • Not measured
Process parameter range Process Temperature
  • Room temperature
Process pressure
  • 150 mTorr
Substrates Batch size
  • One 100 mm wafer
  • Several smaller samples
Allowed materials
  • All materials allowed in the cleanroom


The Balzer Sputter coater

The Hummer sputter located coater in the 346 basement

The Balzer sputter coater is used to sputter a thin gold layer on different small samples (smaller than 100 mm wafers).

One of the most effective ways to counter the problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The Hummer sputter coater is an instrument that allows you to coat small samples with a gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps the gold layer will effectively eliminate all charging problems in the SEM.

The Balzer sputter coater is located in the 346 basement, room 907 (next to the SEM Jeol) .

The user manual and contact information can be found in LabManager:

Balzer sputter coater

Process knowledge

Overview of the performance of the Hummer sputter coater and some process related parameters

Purpose
  • Gold sputter coating of different samples mainly before SEM characterization (see purpose)
Performance Film thickness
  • 10 Å - > 25 nm
Deposition rate
  • Not measured
Process parameter range Process Temperature
  • Room temperature
Process pressure
  • 5*10 -2 mbar
Substrates Batch size
  • One sample smaller than a 100 mm wafer
  • Several smaller samples
Allowed materials
  • All materials allowed in the cleanroom
  • Samples from outside the cleanroom, including biological samples

The Sputter coater 03 (Cressington sputter coater)

Sputter coater 03 (Cressington) located in the 346 basement, room 907

The Sputter coater is used to sputter a thin gold layer on different small samples (smaller than 100 mm wafers). Itthe

One of the most effective ways to counter problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The sputter coater allows you to coat small samples with a thin gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps, the gold layer will effectively eliminate all charging problems in the SEM.

The Balzer sputter coater is located in the 346 basement, room 907 (next to the SEM Supra 1) .

The user manual and contact information can be found in LabManager:

Sputter coater 03

Process knowledge

Overview of the performance of the Sputter coater 03 (Cressington) and some process related parameters

Purpose
  • Gold sputter coating of different samples before SEM characterization
Performance Film thickness
  • Not measured. The maximum allowed sputter time is 30 s
Deposition rate
  • Not measured
Process parameter range Pressure
  • 0.01 mbar
Sputter time
  • Maximum 30 s
Substrates Batch size
  • One sample smaller than a 100 mm wafer
  • Several smaller samples
Allowed materials
  • All samples that are allowed in the SEM Supra 1