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| Line 668: |
Line 668: |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| |
| All cleanroom materials except III-V materials | | All cleanroom materials except III-V materials |
| |-
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| |style="background:LightGrey; color:black"|Batch
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 1
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| |-
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| |}
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| <br clear="all" />
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|
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| ==Manual Spinner (Polymers)==
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|
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| [[Image:IMG 1179.JPG|300x300px|thumb|right|The Manual Spinner (Polymers): positioned in fumehood in C-1]]
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|
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| '''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Manual_Spinner_(Polymers) click here]'''
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|
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| ''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
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|
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| '''IS BEING DECOMISSIONED AS SOON AS POSSIBLE'''
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|
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| Manual Spinner (Polymers), OPTIcoat SB20+, from ATMSSE is a resist spinning coater at Danchip which is dedicated for single wafers spinning of e-beam resist, the hot embossing/UV imprint polymers and SU8 resit mixed with color/nano particals.
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|
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| All polymers must be validated manually during the use. On this spinner you can spin whole 2", 4" and 6" substrates and also a small pieces.
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|
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| '''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=251 LabManager]'''
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|
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| === Equipment performance and process related parameters ===
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|
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| {| border="2" cellspacing="0" cellpadding="2"
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|
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|
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| !style="background:silver; color:black;" align="center" width="60"|Purpose
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black"|
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| *Spin coating of hot embossing polymers
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| *Spin coating of UV imprinting polymers
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| *Spin coating of e-beam resists
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| *Spin coating of SU8 resists mixed with color/nano particles
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| |-
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| !style="background:silver; color:black;" align="center" width="60"|Resist
| |
| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * PMMA
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| * Topas
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| * e-beam resits
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| * SU8 resists mixed with color/nano particles
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
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| |style="background:LightGrey; color:black"|Coating thickness
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * resist depended
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
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| |style="background:LightGrey; color:black"|Spin speed
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 100 - 5000 rpm
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| |-
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| |style="background:LightGrey; color:black"|Spin acceleration
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 100 - 5000 rpm/s
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| |-
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| |style="background:LightGrey; color:black"|Hotplate temperature
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * changeable temperature from 20° to 200°
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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| |style="background:LightGrey; color:black"|Substrate size
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| * 50 mm wafers
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| * 100 mm wafers
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| * 150 mm wafers
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| * down to 10x10mm pieces
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| |-
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| | style="background:LightGrey; color:black"|Allowed materials
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| All cleanroom materials except III-V materials
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| |- | | |- |
| |style="background:LightGrey; color:black"|Batch | | |style="background:LightGrey; color:black"|Batch |
