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Specific Process Knowledge/Lithography/Strip: Difference between revisions

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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
Line 276: Line 276:
*Rinse your wafers for 4-5 min. in running water after stripping .
*Rinse your wafers for 4-5 min. in running water after stripping .


'''The user APV, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=70 Rough Strip] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=72 Fine Strip]'''
 
'''Contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=70 Rough Strip] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=72 Fine Strip]'''


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