Specific Process Knowledge/Lithography/Strip: Difference between revisions
| Line 160: | Line 160: | ||
|'''Process power''' | |'''Process power''' | ||
|600-1000W | |600-1000W | ||
| | |150-300W | ||
|150-300W | |150-300W | ||
|1000W or less for heat- sensitive materials | |1000W or less for heat- sensitive materials | ||
| Line 171: | Line 171: | ||
|- | |- | ||
|'''Batch size''' | |'''Batch size''' | ||
|1- | |1-30 | ||
| | |1-10 | ||
|1 wafer at a time | |1 wafer at a time | ||
|1 wafer at a time, use a container, e.g Petri dish | |1 wafer at a time, use a container, e.g Petri dish | ||
|- | |- | ||
|} | |} | ||