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Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Chasil (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
547 edits
Line 194: Line 194:
| 4
| 4
| 20 µm
| 20 µm
| [[media:Cutting_Pyrex_microfluidic_hole_1064nm_255mm.xls|Cutting Pyrex 1000µm for microfluidic hole parameters]]
| [[media:Cutting_Pyrex_1064nm_255mm.xls|Cutting Pyrex 525µm parameters]]
| Increase/decrease the number of iteration to increase/decrease the width of the hole. [[file:pyrex_10um_hole_chanel.jpg|Microscope view of the chanel  ]]
| Cutting through. Dicing circle.  
|-
|-
|}
|}
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