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Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Chasil (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
547 edits
Line 125: Line 125:
|- style="background:LightGray" valign="top"
|- style="background:LightGray" valign="top"
| Silicon
| Silicon
| Red (1064nm/255mm)
| Green(532nm/255mm)
| 200 kHz
| 200 kHz
| 100%
| 100%
Line 138: Line 138:
| Easily break silicon in cristal plan. Depth of the groove : 25µm  
| Easily break silicon in cristal plan. Depth of the groove : 25µm  
|- style="background:LightGray" valign="top"
|- style="background:LightGray" valign="top"
| Silicon with SiliconNitride
| Silicon with SiO2
|
|
|
| Red (1064nm/255mm)
| Red (1064nm/255mm)
|  
| 200 kHz
| 100%
| 100%
| ?? mm/s
| 2,8 W
|
| 50 mm/s
| 1 burst
| none
| 4 it.
| 1
| N/A
| [[silicon cutting.par]]
| [[silicon cutting.par]]
| Easily break silicon in cristal plan. Depth of the groove : 25µm
|-
|-
|}
|}
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