Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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| align="left" valign="top" style="background:#DCDCDC;"|''' Power measured @10%''' | | align="left" valign="top" style="background:#DCDCDC;"|''' Power measured @10%''' | ||
| align="left" valign="top" style="background:LightGray"|''' Writing speed''' | | align="left" valign="top" style="background:LightGray"|''' Writing speed''' | ||
| align="left" valign="top" style="background:LightGray"|''' | | align="left" valign="top" style="background:LightGray"|''' Number of burst''' | ||
| align="left" valign="top" style="background:LightGray"|''' Number of Z-offset''' | |||
| align="left" valign="top" style="background:LightGray"|''' Number of iteration''' | |||
| align="left" valign="top" style="background:LightGray"|''' Number of parallel lines''' | | align="left" valign="top" style="background:LightGray"|''' Number of parallel lines''' | ||
| align="left" valign="top" style="background:LightGray"|''' Gap in between line''' | | align="left" valign="top" style="background:LightGray"|''' Gap in between line''' | ||
| align="left" valign="top" style="background:LightGray"|''' Parameter file''' | | align="left" valign="top" style="background:LightGray"|''' Parameter file''' | ||
| align="left" valign="top" style="background:LightGray"|''' Comments''' | |||
|- style="background:LightGray" valign="top" | |- style="background:LightGray" valign="top" | ||
| Silicon | | Silicon | ||
| Line 129: | Line 128: | ||
| 200 kHz | | 200 kHz | ||
| 100% | | 100% | ||
| | | 0,57 W | ||
| | | 50 mm/s | ||
| | | 1 burst | ||
| | | none | ||
| | | 4 it. | ||
| 1 | |||
| N/A | |||
| [[silicon cutting.par]] | | [[silicon cutting.par]] | ||
| Easily break silicon in cristal plan. Depth of the groove : 25µm | |||
|- style="background:LightGray" valign="top" | |- style="background:LightGray" valign="top" | ||
| Silicon with SiliconNitride | | Silicon with SiliconNitride | ||