Specific Process Knowledge/Characterization/XRD/XRD SmartLab: Difference between revisions
No edit summary |
|||
| (7 intermediate revisions by 2 users not shown) | |||
| Line 2: | Line 2: | ||
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b><br> | <i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b><br> | ||
All images and photos on this page | All images and photos on this page belongs to <b>DTU Nanolab</b></i> | ||
= XRD SmartLab = | = XRD SmartLab = | ||
| Line 14: | Line 16: | ||
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=428 XRD SmartLab in LabManager] - requires login | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=428 XRD SmartLab in LabManager] - requires login | ||
'''For XRD SmartLab Users at Nanolab:''' There's a bug in the software in the cleanroom, so the Parts Help doesn't show up with useful information about the optics used in Optical and Sample Alignment when you click the '?'. We copied the Parts Help from the newer XRD Rot Anode so you can the information: | |||
*On the Desktop of the Smartlab computer in the cleanroom | |||
*In the Cleanroom Drive under _Equipment/XRD/PartsHelp_fromXRDRotAnode_SLSII | |||
| Line 20: | Line 26: | ||
[http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Characterization/XRD/Process_Info Process information] | [http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Characterization/XRD/Process_Info Process information] | ||
The basic optical components and the automatic optical alignment steps are described here: | |||
[https://www.youtube.com/watch?v=AbM1TwG5HyU Optical alignment video on Rigaku's Youtube channel] | |||
The measurement settings and results of the pre-acceptance test are described in this document, also found on the Lab Manager: | The measurement settings and results of the pre-acceptance test are described in this document, also found on the Lab Manager: | ||
| Line 48: | Line 57: | ||
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_MgO#X-Ray_Reflectivity|Sputtered deposited MgO thin films]]. | * Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_MgO#X-Ray_Reflectivity|Sputtered deposited MgO thin films]]. | ||
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Scandium/Sc_Sputtering_in_Cluster_Lesker_PC3#X-ray_Reflectivity_(XRR)|Sputtered deposited Sc thin films]]. | |||
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Scandium_Nitride/ScN_Reactive_Sputtering_in_Cluster_Lesker_PC3#X-ray_Reflectivity_(XRR)|Sputtered deposited ScN thin films]]. | |||
<!-- * Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR_and_SE_comparison|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].--> | <!-- * Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR_and_SE_comparison|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].--> | ||
==Grazing Incidence X-ray Diffraction XRD (GiXRD)== | |||
* Evaluation of [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab/Instrumental broading in GiXRD|Instrumental broading in GiXRD]]. | |||
==θ/2θ X-ray Diffraction== | |||
* Evaluation of [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab/Instrumental broading in T2T|Instrumental broadening in symmetrical θ/2θ measurements]]. | |||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||
| Line 106: | Line 128: | ||
0.4 mm x 8 mm (Line/Point) | 0.4 mm x 8 mm (Line/Point) | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan=" | !style="background:silver; color:black" align="center" valign="center" rowspan="4"|Goniometer | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
Scanning mode | Scanning mode | ||
| Line 131: | Line 153: | ||
*Rx,Ry:-5~+5° | *Rx,Ry:-5~+5° | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Optics | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Optics | ||
|style="background:LightGrey; color:black"|Incident side | |style="background:LightGrey; color:black"|Incident side | ||
| Line 156: | Line 173: | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
up to 150 mm wafers | up to 150 mm wafers; thickness up to 21 mm | ||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
All materials | All materials allowed in the cleanroom | ||
|- | |- | ||
|} | |} | ||
<br clear="all" /> | <br clear="all" /> | ||