Specific Process Knowledge/Characterization/XRD/XRD SmartLab: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab click here]''' | ||
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b><br> | |||
All images and photos on this page belongs to <b>DTU Nanolab</b></i> | |||
= XRD SmartLab = | = XRD SmartLab = | ||
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The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm. | The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm. | ||
[[image:XRD_SmartLab.jpg| | [[image:XRD_SmartLab.jpg|400x400px|right|thumb|The XRD SmartLab located in cleanroom F-2]] | ||
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[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=428 XRD SmartLab in LabManager] - requires login | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=428 XRD SmartLab in LabManager] - requires login | ||
'''For XRD SmartLab Users at Nanolab:''' There's a bug in the software in the cleanroom, so the Parts Help doesn't show up with useful information about the optics used in Optical and Sample Alignment when you click the '?'. We copied the Parts Help from the newer XRD Rot Anode so you can the information: | |||
*On the Desktop of the Smartlab computer in the cleanroom | |||
*In the Cleanroom Drive under _Equipment/XRD/PartsHelp_fromXRDRotAnode_SLSII | |||
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The measurement settings and results of the pre-acceptance test are described in this document, also found on the | The measurement settings and results of the pre-acceptance test are described in this document, also found on the Lab Manager: | ||
[https://labmanager.dtu.dk/ | |||
*[https://labmanager.dtu.dk/view_binary.php?fileId=5413| (FAT) Factory Acceptance Test] - requires login | |||
The same measurement were completed as part of the acceptance, but no report was generated. In addition the inspection certificate is available here: | |||
*[https://labmanager.dtu.dk/view_binary.php?fileId=5414| (SAT) Site Acceptance Test] - requires login | |||
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* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_MgO#X-Ray_Reflectivity|Sputtered deposited MgO thin films]]. | * Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_MgO#X-Ray_Reflectivity|Sputtered deposited MgO thin films]]. | ||
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Scandium/Sc_Sputtering_in_Cluster_Lesker_PC3#X-ray_Reflectivity_(XRR)|Sputtered deposited Sc thin films]]. | |||
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Scandium_Nitride/ScN_Reactive_Sputtering_in_Cluster_Lesker_PC3#X-ray_Reflectivity_(XRR)|Sputtered deposited ScN thin films]]. | |||
<!-- * Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR_and_SE_comparison|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].--> | <!-- * Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR_and_SE_comparison|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].--> | ||
==Grazing Incidence X-ray Diffraction XRD (GiXRD)== | |||
* Evaluation of [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab/Instrumental broading in GiXRD|Instrumental broading in GiXRD]]. | |||
==θ/2θ X-ray Diffraction== | |||
* Evaluation of [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab/Instrumental broading in T2T|Instrumental broadening in symmetrical θ/2θ measurements]]. | |||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||
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0.4 mm x 8 mm (Line/Point) | 0.4 mm x 8 mm (Line/Point) | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan=" | !style="background:silver; color:black" align="center" valign="center" rowspan="4"|Goniometer | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
Scanning mode | Scanning mode | ||
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*Rx,Ry:-5~+5° | *Rx,Ry:-5~+5° | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Optics | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Optics | ||
|style="background:LightGrey; color:black"|Incident side | |style="background:LightGrey; color:black"|Incident side | ||
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|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
up to 150 mm wafers | up to 150 mm wafers; thickness up to 21 mm | ||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
All materials | All materials allowed in the cleanroom | ||
|- | |- | ||
|} | |} | ||
<br clear="all" /> | <br clear="all" /> | ||