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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development click here]'''
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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Development click here]'''


[[Category: Equipment|Lithography development]]
[[Category: Lithography|Development]]


==Coaters: Comparison Table==
__TOC__


{| border="2" cellspacing="0" cellpadding="2"
=Development Comparison Table=
 
{| class="wikitable"
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-1 and Developer-2|Developer 1 and 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-6inch|Developer-6inch]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#SU8-Developer|SU8-Developer]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-TMAH|Developer-TMAH]]</b>
 
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**AZ5214E resist
**AZ4562 resist
**E-beam resist
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**AZ5214E resist
**AZ4562 resist
**SU8 resist
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**SU8 resist
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*Coating and baking of
**AZ MiR 701 (29cps) resist
**AZ nLOF 2020 resist
*Post-exposure baking at 110°C
 
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Substrate handling
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Edge handling chuck
|style="background:WhiteSmoke; color:black"|
* Single substrate
* Non-vacuum chuck for fragile substrates
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
|-
|-
|style="background:LightGrey; color:black"|Permanent media
!
|style="background:WhiteSmoke; color:black"|
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
* AZ5214E resist
! [[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wet bench)]]
* AZ4562 resist
! [[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
* Acetone for chuck cleaning
! [[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
* Acetone for drip pan
! [[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]
* AZ5214E resist
* PGMEA for edge bead removal
* Acetone for chuck cleaning
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
* AZ nLOF 2020 resist
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
|-
|-
|style="background:LightGrey; color:black"|Manual dispense option
! scope=row style="text-align: left;" | Purpose
|style="background:WhiteSmoke; color:black"|
|
* 2 automatic syringes
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools
|style="background:WhiteSmoke; color:black"|
* yes
* pneumatic dispense for SU8 resist
|style="background:WhiteSmoke; color:black"|
* no


|-
<span style="color:red">Requires individual risk assessment for TMAH development!</span>
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|
|style="background:LightGrey; color:black"|Spindle speed
Development of:
|style="background:WhiteSmoke; color:black"|
*SU-8
*100-5000 rpm
|
|style="background:WhiteSmoke; color:black"|
Development of:
*100-5000 rpm
*ZEP 520A
|style="background:WhiteSmoke; color:black"|
*AR-P 6200.xx (CSAR)
*10 - 9990 rpm
|
|-
Development of:
|style="background:LightGrey; color:black"|Gyrset
*AZ nLOF
|style="background:WhiteSmoke; color:black"|
*AZ MiR 701
*optinal
|style="background:WhiteSmoke; color:black"|
*optinal
|style="background:WhiteSmoke; color:black"|
*no
 
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate  size
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*100 mm wafers
*150 mm wafers
|style="background:WhiteSmoke; color:black"|
*100 mm wafer
*150 mm wafer
|style="background:WhiteSmoke; color:black"|
*100 mm wafers
*150 mm wafers (tool change required)
|-
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*1-24
|style="background:WhiteSmoke; color:black"|
*1
|style="background:WhiteSmoke; color:black"|
*1-25
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
|style="background:WhiteSmoke; color:black"|
*Silicon
*Glass
|-
|}
 
<br clear="all" />
 
==Developer-1 and Developer-2==
[[Image:Developer1&2.jpg|300 × 300px|thumb|right|Developer-1 (right) and Developer-2 (left) are located in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-1_and_Developer-2 click here]'''
 
Developer-1 and Developer-2 are manual developer baths for submersion development of AZ 5214E and AZ 4562 resists in AZ 351B developer. The developer is mixed 1:5 in water by the user prior to development start, and the wafer cassette is agitated manually by the user during development. The development time is controlled manually by the user.
 
'''The user APV, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=62 Developer-1] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=63 Developer-2]'''
 
===Process information===
 
*Before using one of developer baths, please check the "Litho4_Dev-7up-KOH" logbook to find out when they were last used. A fresh bath can be reused without problems.
*The main rule is a developer made yesterday must be changed.
*Rinse substrates with water for 4-5 min. after development.
*Spin-dry substrates or dry with nitrogen gun after rinsing.
 
'''Standard development time using vigorous agitation:'''
 
'''AZ 5214E:'''
*1.5µm resist: 60 sec
*2.2µm resist: 70 sec
*4.2µm resist: 3 min
'''AZ 4562:'''
*10µm resist: 5 min
 
====Procedure for making a new developer====
 
1. 800ml "Developer AZ 351B" is mixed with 4000ml water in a special container in the fume hood.
 
2. Fill the bath with the developer mixture and heat it to 22 °C before use.
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ 5214E
*AZ 5214E
*AZ 4562
*AZ 4562
|-
*DUV resists
!style="background:silver; color:black;" align="center" width="60"|Developer
|  
|style="background:LightGrey; color:black"|
Development of:
|style="background:WhiteSmoke; color:black" align="center"|
*AZ nLOF
AZ 351B diluted 1:5 in water
*AZ MiR 701
 
(NaOH and sodium borate salt)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Submersion
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
22°C
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
Manual
|-
|style="background:LightGrey; color:black"|Rinse
|style="background:WhiteSmoke; color:black" align="center"|
DI water
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
Silicon, glass, and polymer substrates
 
Film or pattern of all types
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1-8
|-
|}
 
<br clear="all" />
 
==Developer-6inch==
 
[[image:6inchDeveloper.jpg|300x300px|right|thumb|The Developer-6inch bench is located in E-5]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Developers#Developer-6inch click here]'''
 
The Developer-6inch bench is an automated developer bath for submersion development of AZ 5214E and AZ 4562 resists in AZ 351B developer. The developer is mixed 1:5 in water by the equipment prior to development start. The developer is circulated during development, and the wafer cassette may be agitated by a mechanical elevator.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=189 LabManager]'''
 
===Process information===
 
'''Standard development time:'''
 
'''AZ 5214E:'''
*1.5µm resist: 60 sec
*2.2µm resist: 70 sec
*4.2µm resist: 3 min
'''AZ 4562:'''
*10µm resist: 5 min
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ 5214E
*AZ 5214E
*AZ 4562
*AZ 4562
*DUV resists
Post-exposure baking
|
Development of:
*DUV resists
Post-exposure baking
|-
! scope=row style="text-align: left;" | Developer
| Process dependent
| mr-Dev 600 (PGMEA)
|
*ZED N-50
*AR 600-50
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
! scope=row style="text-align: left;" | Method
|style="background:LightGrey; color:black"|
| Submersion
|style="background:WhiteSmoke; color:black" align="center"|
| Submersion
AZ 351B diluted 1:5 in water
| Puddle
 
| Puddle
(NaOH and sodium borate salt)
| Puddle
| Puddle
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
! scope=row style="text-align: left;" | Handling
|style="background:LightGrey; color:black"|
|
|style="background:WhiteSmoke; color:black" align="center"|
Manual handling in beakers
Submersion
*Chip bucket
*Single wafer carrier
*Carrier for up to 5 wafers
|
*Chip bucket
*Single wafer carrier
*Carrier for up to 6 wafers
|
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 50 mm substrates
|
*Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
*Chip chuck for chips & 50 mm substrates
| Vacuum chuck
| Vacuum chuck
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
! scope=row style="text-align: left;" | Process temperature
|style="background:LightGrey; color:black"|Temperature
| Room temperature
|style="background:WhiteSmoke; color:black" align="center"|
| Room temperature
22°C
| Room temperature
| Room temperature
| Room temperature
| Room temperature
|-
|-
|style="background:LightGrey; color:black"|Agitation
! scope=row style="text-align: left;" | Process agitation
|style="background:WhiteSmoke; color:black" align="center"|
| No agitation allowed
Circulation and mechanical
| Magnetic stirrer
| Rotation
| Rotation
| Rotation
| Rotation
|-
|-
|style="background:LightGrey; color:black"|Rinse
! scope=row style="text-align: left;" | Process rinse
|style="background:WhiteSmoke; color:black" align="center"|
| Process dependent
DI water
| IPA
| IPA
| DI water
| DI water
| DI water
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Substrate size
|style="background:LightGrey; color:black"|Substrate size
|
|style="background:WhiteSmoke; color:black" align="center"|
* Chips
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
|
* Chips
* 50 mm wafers
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
|-
* 200 mm wafers
| style="background:LightGrey; color:black"|Allowed materials
|
|style="background:WhiteSmoke; color:black" align="center"|
* Chips (5mm to 2")
Silicon, glass, and polymer substrates
* 50 mm wafers
 
* 100 mm wafers
Film or pattern of all types
* 150 mm wafers
|-
* 200 mm wafers
|style="background:LightGrey; color:black"|Batch
|
|style="background:WhiteSmoke; color:black" align="center"|
* Chips (5mm to 50 mm)
1-25
* 100 mm wafers
|-
* 150 mm wafers
|}
|
 
* 100 mm wafers
<br clear="all" />
* 150 mm wafers
 
* 200 mm wafers (may require tool change)
==SU8-Developer==
|
[[Image:SU-8developer.jpg|300×300px|right|thumb|The SU8-Developer bench is located in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#SU8-Developer click here]'''
 
The SU8-Developer bench is a manually operated chemical bench for submersion development of SU-8 photoresist in PGMEA (supplied in the cleanroom as mr-Dev 600). After development, the substrates are rinsed with IPA and dried in the bench.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=154 LabManager]'''
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*SU-8
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
mr-Dev 600
 
(PGMEA)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Submersion
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
Room temperature
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
Magnetic stirrer
|-
|style="background:LightGrey; color:black"|Rinse
|style="background:WhiteSmoke; color:black" align="center"|
IPA
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
| All cleanroom approved materials
Silicon and glass substrates
|
 
*Silicon and glass substrates
Film or pattern of all but Type IV
*Film or pattern of all but Type IV
| All cleanroom approved materials
|
*All cleanroom approved materials
*Film or pattern of all types
|
*Silicon and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|
*Silicon, III-V, and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|-
|-
|style="background:LightGrey; color:black"|Batch
! scope=row style="text-align: left;" | Batch size
|style="background:WhiteSmoke; color:black" align="center"|
| 1 - 5
1-8
| 1 - 6
|-  
| 1
| 1
| 1 - 25
| 1 - 25
|}
|}
<br clear="all" />
<br clear="all" />


==Developer-TMAH==
<!--
[[Image:KSspinner.JPG|300×300px|right|thumb|Developer-TMAH is located in C-1]]
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
-->
<!--
{{:Specific Process Knowledge/Lithography/Development/beaker_developer}}


'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-TMAH click here]'''
{{:Specific Process Knowledge/Lithography/Development/SU8_developer}}


Developer-TMAH is a manually operated, single substrate spray-puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent).
{{:Specific Process Knowledge/Lithography/Development/manualEbeam_developer}}


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager]'''
{{:Specific Process Knowledge/Lithography/Development/manualTMAH_developer}}


===Process information===
{{:Specific Process Knowledge/Lithography/Development/UV_developer}}


'''Standard recipes'''
{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
*nLoF_40x2: double puddle, 40s. For development of AZ nLOF 2020 resist.
-->
*MiR701 60s: single puddle, 60s. For development of AZ MiR 701 resist.
*DUV 60s: single puddle, 60s. For development of DUV resists.


*UTIL-BE: For service use only.
=Decommisioned tools=
*UTIL-DR: Dome rinse.
<span style="color:red">Developer 1 & 2 were decommissioned 2017-01.</span>


=== Equipment performance and process related parameters ===
[[Specific Process Knowledge/Lithography/Development/1and2_developer|Information about decommissioned tool can be found here.]]


{| border="2" cellspacing="0" cellpadding="2"


<span style="color:red">Developer 6 inch was decommissioned 2019-12.</span>


!style="background:silver; color:black;" align="center" width="60"|Purpose
[[Specific Process Knowledge/Lithography/Development/6inch_developer|Information about decommissioned tool can be found here.]]
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
*DUV resists
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ 726 MIF
 
(2.38% TMAH in water)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Puddle
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
Room temperature
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
none
|-
|style="background:LightGrey; color:black"|Rinse
|style="background:WhiteSmoke; color:black" align="center"|
DI water
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
Silicon, glass, and polymer substrates
 
Film or pattern of all types
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1
|-
|}
 
<br clear="all" />

Latest revision as of 12:25, 13 January 2026

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

Development Comparison Table

Manual beaker development Developer: SU8 (Wet bench) Developer: E-beam 02 Developer: TMAH Manual 02 Developer: TMAH UV-lithography Developer: TMAH Stepper
Purpose

Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools

Requires individual risk assessment for TMAH development!

Development of:

  • SU-8

Development of:

  • ZEP 520A
  • AR-P 6200.xx (CSAR)

Development of:

  • AZ nLOF
  • AZ MiR 701
  • AZ 5214E
  • AZ 4562
  • DUV resists

Development of:

  • AZ nLOF
  • AZ MiR 701
  • AZ 5214E
  • AZ 4562
  • DUV resists

Post-exposure baking

Development of:

  • DUV resists

Post-exposure baking

Developer Process dependent mr-Dev 600 (PGMEA)
  • ZED N-50
  • AR 600-50
 AZ 726 MIF (2.38% TMAH in water) AZ 726 MIF (2.38% TMAH in water) AZ 726 MIF (2.38% TMAH in water)
Method Submersion Submersion Puddle Puddle Puddle Puddle
Handling

Manual handling in beakers

  • Chip bucket
  • Single wafer carrier
  • Carrier for up to 5 wafers
  • Chip bucket
  • Single wafer carrier
  • Carrier for up to 6 wafers
  • Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
  • Chip chuck for chips & 50 mm substrates
  • Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
  • Chip chuck for chips & 50 mm substrates
 Vacuum chuck Vacuum chuck
Process temperature Room temperature Room temperature Room temperature Room temperature Room temperature Room temperature
Process agitation No agitation allowed Magnetic stirrer Rotation Rotation Rotation Rotation
Process rinse Process dependent IPA IPA DI water DI water DI water
Substrate size
  • Chips
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • Chips
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • Chips (5mm to 2")
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • Chips (5mm to 50 mm)
  • 100 mm wafers
  • 150 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers (may require tool change)
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers (may require tool change)
Allowed materials All cleanroom approved materials
  • Silicon and glass substrates
  • Film or pattern of all but Type IV
 All cleanroom approved materials
  • All cleanroom approved materials
  • Film or pattern of all types
  • Silicon and glass substrates
  • Films, or patterned films, of any material except type IV (Pb, Te)
  • Silicon, III-V, and glass substrates
  • Films, or patterned films, of any material except type IV (Pb, Te)
Batch size 1 - 5 1 - 6 1 1 1 - 25 1 - 25



Decommisioned tools

Developer 1 & 2 were decommissioned 2017-01.

Information about decommissioned tool can be found here.


Developer 6 inch was decommissioned 2019-12.

Information about decommissioned tool can be found here.

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