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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development click here]'''
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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Development click here]'''


[[Category: Equipment|Lithography development]]
[[Category: Lithography|Development]]


==Coaters: Comparison Table==
__TOC__


{| border="2" cellspacing="0" cellpadding="2"
=Development Comparison Table=
 
{| class="wikitable"
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]</b>
|-
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose
!
|style="background:LightGrey; color:black"|
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wet bench)]]
*Coating and baking of
! [[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
**AZ5214E resist
! [[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
**AZ4562 resist
! [[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
**E-beam resist
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**AZ5214E resist
**AZ4562 resist
**SU8 resist
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*Coating and baking of
**AZ MiR 701 (29cps) resist
**AZ nLOF 2020 resist
*Post-exposure baking at 110°C
 
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
! scope=row style="text-align: left;" | Purpose
|style="background:LightGrey; color:black"|Substrate handling
|
|style="background:WhiteSmoke; color:black"|
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools
* Cassette-to-cassette
* Edge handling chuck
|style="background:WhiteSmoke; color:black"|
* Single substrate
* Non-vacuum chuck for fragile substrates
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette


<span style="color:red">Requires individual risk assessment for TMAH development!</span>
|
Development of:
*SU-8
|
Development of:
*ZEP 520A
*AR-P 6200.xx (CSAR)
|
Development of:
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
*DUV resists
|
Development of:
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
*DUV resists
Post-exposure baking
|
Development of:
*DUV resists
Post-exposure baking
|-
|-
|style="background:LightGrey; color:black"|Permanent media
! scope=row style="text-align: left;" | Developer
|style="background:WhiteSmoke; color:black"|
| Process dependent
* AZ5214E resist
| mr-Dev 600 (PGMEA)
* AZ4562 resist
|
* Acetone for chuck cleaning
*ZED N-50
* Acetone for drip pan
*AR 600-50
|style="background:WhiteSmoke; color:black"|
| AZ 726 MIF (2.38% TMAH in water)
* AZ5214E resist
| AZ 726 MIF (2.38% TMAH in water)
* PGMEA for edge bead removal
| AZ 726 MIF (2.38% TMAH in water)
* Acetone for chuck cleaning
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
* AZ nLOF 2020 resist
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
 
|-
|-
|style="background:LightGrey; color:black"|Manual dispense option
! scope=row style="text-align: left;" | Method
|style="background:WhiteSmoke; color:black"|
| Submersion
* 2 automatic syringes
| Submersion
|style="background:WhiteSmoke; color:black"|
| Puddle
* yes
| Puddle
* pneumatic dispense for SU8 resist
| Puddle
|style="background:WhiteSmoke; color:black"|
| Puddle
* no
|style="background:WhiteSmoke; color:black"|
* Two syringe pumps
 
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
! scope=row style="text-align: left;" | Handling
|style="background:LightGrey; color:black"|Spindle speed
|
|style="background:WhiteSmoke; color:black"|
Manual handling in beakers
*100-5000 rpm
*Chip bucket
|style="background:WhiteSmoke; color:black"|
*Single wafer carrier
*100-5000 rpm
*Carrier for up to 5 wafers
|style="background:WhiteSmoke; color:black"|
|
*10 - 9990 rpm
*Chip bucket
|style="background:WhiteSmoke; color:black"|
*Single wafer carrier
*100-5000 rpm
*Carrier for up to 6 wafers
|style="background:WhiteSmoke; color:black"|
|
*10-5000 rpm
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
|style="background:WhiteSmoke; color:black"|
*Chip chuck for chips & 50 mm substrates
|
*Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
*Chip chuck for chips & 50 mm substrates
| Vacuum chuck
| Vacuum chuck
|-
|-
|style="background:LightGrey; color:black"|Gyrset
! scope=row style="text-align: left;" | Process temperature
|style="background:WhiteSmoke; color:black"|
| Room temperature
*optinal
| Room temperature
|style="background:WhiteSmoke; color:black"|
| Room temperature
*optinal
| Room temperature
|style="background:WhiteSmoke; color:black"|
| Room temperature
*no
| Room temperature
|style="background:WhiteSmoke; color:black"|
*no
|style="background:WhiteSmoke; color:black"|
*no
|style="background:WhiteSmoke; color:black"|
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Process agitation
|style="background:LightGrey; color:black"|Substrate  size
| No agitation allowed
|style="background:WhiteSmoke; color:black"|
| Magnetic stirrer
*50 mm wafers
| Rotation
*100 mm wafers
| Rotation
*150 mm wafers
| Rotation
|style="background:WhiteSmoke; color:black"|
| Rotation
*100 mm wafer
*150 mm wafer
|style="background:WhiteSmoke; color:black"|
*100 mm wafers
*150 mm wafers (tool change required)
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*100 mm wafers
*150 mm wafer
*small pieces down to 10x10 mm2
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*100 mm wafers
*150 mm wafer
*small pieces down to 3x3 mm2
|style="background:WhiteSmoke; color:black"|
*Any sample(s) that fit inside machine
|-
|-
|style="background:LightGrey; color:black"|Batch size
! scope=row style="text-align: left;" | Process rinse
|style="background:WhiteSmoke; color:black"|
| Process dependent
*1-24
| IPA
|style="background:WhiteSmoke; color:black"|
| IPA
*1
| DI water
|style="background:WhiteSmoke; color:black"|
| DI water
*1-25
| DI water
|style="background:WhiteSmoke; color:black"|
*1
|style="background:WhiteSmoke; color:black"|
*1
|style="background:WhiteSmoke; color:black"|
*1
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Substrate size
|style="background:WhiteSmoke; color:black"|
|
*All cleanroom materials except III-V materials
* Chips
|style="background:WhiteSmoke; color:black"|
* 50 mm wafers
*All cleanroom materials except III-V materials
* 100 mm wafers
|style="background:WhiteSmoke; color:black"|
* 150 mm wafers
*Silicon
|
*Glass
* Chips
|style="background:WhiteSmoke; color:black"|
* 50 mm wafers
*All cleanroom materials except III-V materials
* 100 mm wafers
|style="background:WhiteSmoke; color:black"|
* 150 mm wafers
*III-V materials
* 200 mm wafers
*Si, SiO2, SOI
|
|style="background:WhiteSmoke; color:black"|
* Chips (5mm to 2")
*All chemicals to be spray coated must be approved specifically for spray coating
*Any non-toxic, non-particulate and non-crosslinking material is likely to be approved
|-
|}
 
<br clear="all" />
 
==SSE Spinner==
[[Image:SSEspinner2.jpg|200 × 200px|thumb|right|The SSE spinner MAXIMUS: positioned in E-5]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#SSE_Spinner click here]'''
 
SSE Spinner, Maximus 804, SSE Sister Semiconductor Equipment is a resist spinning system at Danchip which can be used for spinning on 2", 4" and 6" substrates.
 
The system is equipped with 2 different resists lines:
*AZ 5214E
*AZ 4562
and
*2 syringe lines, which can be used for spinning of e-beam resist.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=188 LabManager]'''
 
 
<br clear="all" />
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating and soft baking UV sensative resists
*Spin coating and soft baking E-beam resists
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E
* AZ4562
* E-beam resists
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E 1-4,2 µm
* AZ4526 6,2-25 µm
* E-beam resits 0,1-1 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 10000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
* 90°C for softbaking of AZ5214E resist
* 100°C for softbaking of AZ4562 resist
* 110°C for reverse baking of AZ5214E resits
* 180°C for softbaking of e-beam resits
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* 50 mm wafers
* 50 mm wafers
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
* 200 mm wafers
|
* Chips (5mm to 50 mm)
* 100 mm wafers
* 150 mm wafers
|
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| All cleanroom approved materials
All cleanroom materials except III-V materials
|
*Silicon and glass substrates
*Film or pattern of all but Type IV
| All cleanroom approved materials
|
*All cleanroom approved materials
*Film or pattern of all types
|
*Silicon and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|
*Silicon, III-V, and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|-
|-
|style="background:LightGrey; color:black"|Batch
! scope=row style="text-align: left;" | Batch size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| 1 - 5
1 - 24
| 1 - 6
|-  
| 1
| 1
| 1 - 25
| 1 - 25
|}
|}
<br clear="all" />
<br clear="all" />


==Spin Track 1 + 2==
<!--
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
-->
<!--
{{:Specific Process Knowledge/Lithography/Development/beaker_developer}}


[[image:SpinTrack.jpg|300x257px|right|thumb|Spin Track 1 + 2 in C-1]]
{{:Specific Process Knowledge/Lithography/Development/SU8_developer}}


'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Track_1_.2B_2 click here]'''
{{:Specific Process Knowledge/Lithography/Development/manualEbeam_developer}}
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->


Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafers, but is currently set up for 100 mm wafer processing.
{{:Specific Process Knowledge/Lithography/Development/manualTMAH_developer}}


The Spin Track 1 + 2 is controlled using the Recipe Manager software via the touchscreen on the arm attached to the lefthand end of the track. Recipes for the individual modules are developed by Danchip and combined into flows. The user selects a flow (specific to track 1 or 2), and the appropriate recipes will be downloaded and executed on the appropriate track. The other track runs an empty process (no wafers needed), and can unfortunately not be used by a second user while the first user is processing.
{{:Specific Process Knowledge/Lithography/Development/UV_developer}}


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=313 LabManager]'''
{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
-->


===Process information===
=Decommisioned tools=
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|General Spin Track 1 + 2 process information]]
<span style="color:red">Developer 1 & 2 were decommissioned 2017-01.</span>
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming only|HMDS priming on Spin Track 1 and 2]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ MiR 701 (29cps) coating|AZ MiR 701 (29cps) coating on Spin Track 1]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ nLOF 2020 coating|AZ nLOF 2020 coating on Spin Track 2]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#Post-exposure baking (PEB)|Post-exposure baking on Spin Track 2]]


=== Equipment performance and process related parameters ===
[[Specific Process Knowledge/Lithography/Development/1and2_developer|Information about decommissioned tool can be found here.]]


{| border="2" cellspacing="0" cellpadding="2"


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Spin Track
<span style="color:red">Developer 6 inch was decommissioned 2019-12.</span>
|style="background:WhiteSmoke; color:black" align="center"|<b>1</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>2</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*HMDS priming
*Spin coating and soft baking
*Priming, coating, and baking
|style="background:WhiteSmoke; color:black"|
*HMDS priming
*Spin coating and soft baking
*Priming, coating, and baking
*Post-exposure baking
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ MiR 701 (29cps)


positive tone
[[Specific Process Knowledge/Lithography/Development/6inch_developer|Information about decommissioned tool can be found here.]]
|style="background:WhiteSmoke; color:black" align="center"|
AZ nLOF 2020
 
negative tone
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
1 - 3 µm
|style="background:WhiteSmoke; color:black" align="center"|
1 - 4 µm
|-
|style="background:LightGrey; color:black"|HMDS contact angle
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
60° - 90°; standard recipe 82° (on SiO2)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
10 - 9990 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1000 - 50000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
90°C
|style="background:WhiteSmoke; color:black" align="center"|
110°C
|-
|style="background:LightGrey; color:black"|HMDS priming temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
50°C
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
Silicon and glass wafers
 
Film or pattern of all types
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1 - 25
|-
|}
 
<br clear="all" />
 
==KS Spinner==
[[Image:KSspinner.JPG|300×300px|right|thumb|The KS spinner is placed in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#KS_Spinner click here]'''
 
At Danchip we have RC8-THP system which is one of the SUSS MicroTech spinners.
 
The main purpose of this equipment is experimental spinning the different resist.The spinner has one resist line, AZ5214E, for automatic dispense. All other resist dispenses manually from syringe or disposable pipettes. All SU8 spinning are done on this machine.
 
The machine can be also used for spinning on the "difficult" surfaces like the substrates with holes, backside structures and unusual shapes.
 
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=43 LabManager]'''
 
 
<br clear="all" />
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating and soft baking UV sensative resists
*Spin coating SU8 resists
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E permanent line
* AZ4562 manual dispense
* SU8 resists manual dispense
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E 1-4,2 µm
* AZ4526 6,2-10 µm
* SU8 resits 0,1-100 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
* changeable temperature from 20° to 200°
* SU8 must be bake out on SU8 dedicated hotplates
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials except III-V materials
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1
|-
|}
 
<br clear="all" />
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