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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
{{cc-nanolab}}


'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Development click here]'''


'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development click here]'''
[[Category: Equipment|Lithography development]]
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->
[[Category: Lithography|Development]]


== Automatic Developer Bench for 4" and 6" ==
__TOC__


Write a short description of the equipment(s).
=Development Comparison Table=
{| class="wikitable"
|-
!
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]
|-
! scope=row style="text-align: left;" |  Purpose
|
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
<span style="color:red">Requires individual risk assessment for TMAH development!</span>
<!-- remember to remove the type of documents that are not present -->
|
 
Development of:
[[image:Cluster1.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
*SU-8
 
|
<!-- give the link to the equipment info page in LabManager: -->
Development of:
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=316 LabManager]
*ZEP 520A
*AR-P 6200.xx (CSAR)
|
Development of:
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
*DUV resists
|
Development of:
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
*DUV resists
Post-exposure baking
|
Development of:
*DUV resists
Post-exposure baking
|-
! scope=row style="text-align: left;" | Developer
| Process dependent
| mr-Dev 600 (PGMEA)
|
*ZED N-50
*AR 600-50
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
|-
! scope=row style="text-align: left;" | Method
| Submersion
| Submersion
| Puddle
| Puddle
| Puddle
| Puddle
|-
! scope=row style="text-align: left;" | Handling
|
Manual handling in beakers
*Chip bucket
*Single wafer carrier
*Carrier for up to 5 wafers
|
*Chip bucket
*Single wafer carrier
*Carrier for up to 6 wafers
|
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 50 mm substrates
|
*Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
*Chip chuck for chips & 50 mm substrates
| Vacuum chuck
| Vacuum chuck
|-
! scope=row style="text-align: left;" | Process temperature
| Room temperature
| Room temperature
| Room temperature
| Room temperature
| Room temperature
| Room temperature
|-
! scope=row style="text-align: left;" | Process agitation
| No agitation allowed
| Magnetic stirrer
| Rotation
| Rotation
| Rotation
| Rotation
|-
! scope=row style="text-align: left;" | Process rinse
| Process dependent
| IPA
| IPA
| DI water
| DI water
| DI water
|-
! scope=row style="text-align: left;" | Substrate size
|
* Chips
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
|
* Chips
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers
|
* Chips (5mm to 2")
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers
|
* Chips (5mm to 50 mm)
* 100 mm wafers
* 150 mm wafers
|
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|-
! scope=row style="text-align: left;" | Allowed materials
| All cleanroom approved materials
|
*Silicon and glass substrates
*Film or pattern of all but Type IV
| All cleanroom approved materials
|
*All cleanroom approved materials
*Film or pattern of all types
|
*Silicon and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|
*Silicon, III-V, and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|-
! scope=row style="text-align: left;" | Batch size
| 1 - 5
| 1 - 6
| 1
| 1
| 1 - 25
| 1 - 25
|}
<br clear="all" />


== Name of equipment ==
<!--
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
-->
<!--
{{:Specific Process Knowledge/Lithography/Development/beaker_developer}}


Write a short description of the equipment(s).
{{:Specific Process Knowledge/Lithography/Development/SU8_developer}}


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
{{:Specific Process Knowledge/Lithography/Development/manualEbeam_developer}}
<!-- remember to remove the type of documents that are not present -->


[[image:Cluster1.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
{{:Specific Process Knowledge/Lithography/Development/manualTMAH_developer}}


<!-- give the link to the equipment info page in LabManager: -->
{{:Specific Process Knowledge/Lithography/Development/UV_developer}}
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=316 LabManager]


== Process information ==
{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
-->


Link to process pages - e.g. one page for each material
=Decommisioned tools=
<span style="color:red">Developer 1 & 2 were decommissioned 2017-01.</span>


Example:
[[Specific Process Knowledge/Lithography/Development/1and2_developer|Information about decommissioned tool can be found here.]]
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]]


==Equipment performance and process related parameters==


{| border="2" cellspacing="0" cellpadding="2"  
<span style="color:red">Developer 6 inch was decommissioned 2019-12.</span>


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
[[Specific Process Knowledge/Lithography/Development/6inch_developer|Information about decommissioned tool can be found here.]]
|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b>
|style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Purpose 1
*Purpose 2
|style="background:WhiteSmoke; color:black"|
*Purpose 1
*Purpose 2
*Purpose 3
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Response 1
|style="background:WhiteSmoke; color:black"|
*Performance range 1
*Performance range 2
|style="background:WhiteSmoke; color:black"|
*Performance range 1
*Performance range 2
*Performance range 3
|-
|style="background:LightGrey; color:black"|Response 2
|style="background:WhiteSmoke; color:black"|
*Performance range
|style="background:WhiteSmoke; color:black"|
*Performance range
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Parameter 1
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|-
|style="background:LightGrey; color:black"|Parameter 2
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|-
|}

Latest revision as of 12:25, 13 January 2026

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

Development Comparison Table

Manual beaker development Developer: SU8 (Wet bench) Developer: E-beam 02 Developer: TMAH Manual 02 Developer: TMAH UV-lithography Developer: TMAH Stepper
Purpose

Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools

Requires individual risk assessment for TMAH development!

Development of:

  • SU-8

Development of:

  • ZEP 520A
  • AR-P 6200.xx (CSAR)

Development of:

  • AZ nLOF
  • AZ MiR 701
  • AZ 5214E
  • AZ 4562
  • DUV resists

Development of:

  • AZ nLOF
  • AZ MiR 701
  • AZ 5214E
  • AZ 4562
  • DUV resists

Post-exposure baking

Development of:

  • DUV resists

Post-exposure baking

Developer Process dependent mr-Dev 600 (PGMEA)
  • ZED N-50
  • AR 600-50
 AZ 726 MIF (2.38% TMAH in water) AZ 726 MIF (2.38% TMAH in water) AZ 726 MIF (2.38% TMAH in water)
Method Submersion Submersion Puddle Puddle Puddle Puddle
Handling

Manual handling in beakers

  • Chip bucket
  • Single wafer carrier
  • Carrier for up to 5 wafers
  • Chip bucket
  • Single wafer carrier
  • Carrier for up to 6 wafers
  • Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
  • Chip chuck for chips & 50 mm substrates
  • Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
  • Chip chuck for chips & 50 mm substrates
 Vacuum chuck Vacuum chuck
Process temperature Room temperature Room temperature Room temperature Room temperature Room temperature Room temperature
Process agitation No agitation allowed Magnetic stirrer Rotation Rotation Rotation Rotation
Process rinse Process dependent IPA IPA DI water DI water DI water
Substrate size
  • Chips
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • Chips
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • Chips (5mm to 2")
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • Chips (5mm to 50 mm)
  • 100 mm wafers
  • 150 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers (may require tool change)
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers (may require tool change)
Allowed materials All cleanroom approved materials
  • Silicon and glass substrates
  • Film or pattern of all but Type IV
 All cleanroom approved materials
  • All cleanroom approved materials
  • Film or pattern of all types
  • Silicon and glass substrates
  • Films, or patterned films, of any material except type IV (Pb, Te)
  • Silicon, III-V, and glass substrates
  • Films, or patterned films, of any material except type IV (Pb, Te)
Batch size 1 - 5 1 - 6 1 1 1 - 25 1 - 25



Decommisioned tools

Developer 1 & 2 were decommissioned 2017-01.

Information about decommissioned tool can be found here.


Developer 6 inch was decommissioned 2019-12.

Information about decommissioned tool can be found here.

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