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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development click here]'''
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== Name of equipment ==
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Development click here]'''


Write a short description of the equipment(s).
[[Category: Equipment|Lithography development]]
[[Category: Lithography|Development]]


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
__TOC__
<!-- remember to remove the type of documents that are not present -->


[[image:Cluster1.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
=Development Comparison Table=
{| class="wikitable"
|-
!
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]
|-
! scope=row style="text-align: left;" |  Purpose
|
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools


<!-- give the link to the equipment info page in LabManager: -->
<span style="color:red">Requires individual risk assessment for TMAH development!</span>
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=316 LabManager]
|
 
Development of:
== Process information ==
*SU-8
 
|
Link to process pages - e.g. one page for each material
Development of:
 
*ZEP 520A
Example:
*AR-P 6200.xx (CSAR)
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]]
|
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]]
Development of:
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]]
*AZ nLOF
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]]
*AZ MiR 701
 
*AZ 5214E
==Equipment performance and process related parameters==
*AZ 4562
 
*DUV resists
{| border="2" cellspacing="0" cellpadding="2"
|  
 
Development of:
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
*AZ nLOF
|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b>
*AZ MiR 701
|style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
*AZ 5214E
*AZ 4562
*DUV resists
Post-exposure baking
|
Development of:
*DUV resists
Post-exposure baking
|-
! scope=row style="text-align: left;" | Developer
| Process dependent
| mr-Dev 600 (PGMEA)
|  
*ZED N-50
*AR 600-50
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
|-
! scope=row style="text-align: left;" | Method
| Submersion
| Submersion
| Puddle
| Puddle
| Puddle
| Puddle
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
! scope=row style="text-align: left;" | Handling
|style="background:LightGrey; color:black"|  
|
|style="background:WhiteSmoke; color:black"|
Manual handling in beakers
*Purpose 1
*Chip bucket
*Purpose 2
*Single wafer carrier
|style="background:WhiteSmoke; color:black"|
*Carrier for up to 5 wafers
*Purpose 1
|
*Purpose 2
*Chip bucket
*Purpose 3
*Single wafer carrier
*Carrier for up to 6 wafers
|
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 50 mm substrates
|
*Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
*Chip chuck for chips & 50 mm substrates
| Vacuum chuck
| Vacuum chuck
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
! scope=row style="text-align: left;" | Process temperature
|style="background:LightGrey; color:black"|Response 1
| Room temperature
|style="background:WhiteSmoke; color:black"|
| Room temperature
*Performance range 1
| Room temperature
*Performance range 2
| Room temperature
|style="background:WhiteSmoke; color:black"|
| Room temperature
*Performance range 1
| Room temperature
*Performance range 2
*Performance range 3
|-
|-
|style="background:LightGrey; color:black"|Response 2
! scope=row style="text-align: left;" | Process agitation
|style="background:WhiteSmoke; color:black"|
| No agitation allowed
*Performance range
| Magnetic stirrer
|style="background:WhiteSmoke; color:black"|
| Rotation
*Performance range
| Rotation
| Rotation
| Rotation
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
! scope=row style="text-align: left;" | Process rinse
|style="background:LightGrey; color:black"|Parameter 1
| Process dependent
|style="background:WhiteSmoke; color:black"|
| IPA
*Range
| IPA
|style="background:WhiteSmoke; color:black"|
| DI water
*Range
| DI water
| DI water
|-
|-
|style="background:LightGrey; color:black"|Parameter 2
! scope=row style="text-align: left;" | Substrate size
|style="background:WhiteSmoke; color:black"|
|
*Range
* Chips
|style="background:WhiteSmoke; color:black"|
* 50 mm wafers
*Range
* 100 mm wafers
* 150 mm wafers
|
* Chips
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers
|
* Chips (5mm to 2")
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers
|
* Chips (5mm to 50 mm)
* 100 mm wafers
* 150 mm wafers
|
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Allowed materials
|style="background:LightGrey; color:black"|Batch size
| All cleanroom approved materials
|style="background:WhiteSmoke; color:black"|
|
*<nowiki>#</nowiki> small samples
*Silicon and glass substrates
*<nowiki>#</nowiki> 50 mm wafers
*Film or pattern of all but Type IV
*<nowiki>#</nowiki> 100 mm wafers
| All cleanroom approved materials
*<nowiki>#</nowiki> 150 mm wafers
|
|style="background:WhiteSmoke; color:black"|
*All cleanroom approved materials
*<nowiki>#</nowiki> small samples
*Film or pattern of all types
*<nowiki>#</nowiki> 50 mm wafers
|
*<nowiki>#</nowiki> 100 mm wafers
*Silicon and glass substrates
*<nowiki>#</nowiki> 150 mm wafers
*Films, or patterned films, of any material except type IV (Pb, Te)
|
*Silicon, III-V, and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Batch size
|style="background:WhiteSmoke; color:black"|
| 1 - 5
*Allowed material 1  
| 1 - 6
*Allowed material 2
| 1
|style="background:WhiteSmoke; color:black"|
| 1
*Allowed material 1  
| 1 - 25
*Allowed material 2
| 1 - 25
*Allowed material 3
|-  
|}
|}
<br clear="all" />
<!--
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
-->
<!--
{{:Specific Process Knowledge/Lithography/Development/beaker_developer}}
{{:Specific Process Knowledge/Lithography/Development/SU8_developer}}
{{:Specific Process Knowledge/Lithography/Development/manualEbeam_developer}}
{{:Specific Process Knowledge/Lithography/Development/manualTMAH_developer}}
{{:Specific Process Knowledge/Lithography/Development/UV_developer}}
{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
-->
=Decommisioned tools=
<span style="color:red">Developer 1 & 2 were decommissioned 2017-01.</span>
[[Specific Process Knowledge/Lithography/Development/1and2_developer|Information about decommissioned tool can be found here.]]
<span style="color:red">Developer 6 inch was decommissioned 2019-12.</span>
[[Specific Process Knowledge/Lithography/Development/6inch_developer|Information about decommissioned tool can be found here.]]

Latest revision as of 12:25, 13 January 2026

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

Development Comparison Table

Manual beaker development Developer: SU8 (Wet bench) Developer: E-beam 02 Developer: TMAH Manual 02 Developer: TMAH UV-lithography Developer: TMAH Stepper
Purpose

Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools

Requires individual risk assessment for TMAH development!

Development of:

  • SU-8

Development of:

  • ZEP 520A
  • AR-P 6200.xx (CSAR)

Development of:

  • AZ nLOF
  • AZ MiR 701
  • AZ 5214E
  • AZ 4562
  • DUV resists

Development of:

  • AZ nLOF
  • AZ MiR 701
  • AZ 5214E
  • AZ 4562
  • DUV resists

Post-exposure baking

Development of:

  • DUV resists

Post-exposure baking

Developer Process dependent mr-Dev 600 (PGMEA)
  • ZED N-50
  • AR 600-50
 AZ 726 MIF (2.38% TMAH in water) AZ 726 MIF (2.38% TMAH in water) AZ 726 MIF (2.38% TMAH in water)
Method Submersion Submersion Puddle Puddle Puddle Puddle
Handling

Manual handling in beakers

  • Chip bucket
  • Single wafer carrier
  • Carrier for up to 5 wafers
  • Chip bucket
  • Single wafer carrier
  • Carrier for up to 6 wafers
  • Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
  • Chip chuck for chips & 50 mm substrates
  • Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
  • Chip chuck for chips & 50 mm substrates
 Vacuum chuck Vacuum chuck
Process temperature Room temperature Room temperature Room temperature Room temperature Room temperature Room temperature
Process agitation No agitation allowed Magnetic stirrer Rotation Rotation Rotation Rotation
Process rinse Process dependent IPA IPA DI water DI water DI water
Substrate size
  • Chips
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • Chips
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • Chips (5mm to 2")
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • Chips (5mm to 50 mm)
  • 100 mm wafers
  • 150 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers (may require tool change)
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers (may require tool change)
Allowed materials All cleanroom approved materials
  • Silicon and glass substrates
  • Film or pattern of all but Type IV
 All cleanroom approved materials
  • All cleanroom approved materials
  • Film or pattern of all types
  • Silicon and glass substrates
  • Films, or patterned films, of any material except type IV (Pb, Te)
  • Silicon, III-V, and glass substrates
  • Films, or patterned films, of any material except type IV (Pb, Te)
Batch size 1 - 5 1 - 6 1 1 1 - 25 1 - 25



Decommisioned tools

Developer 1 & 2 were decommissioned 2017-01.

Information about decommissioned tool can be found here.


Developer 6 inch was decommissioned 2019-12.

Information about decommissioned tool can be found here.

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