Jump to content

Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

← Older edit
VisualWikitext
Elkh (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
343 edits
No edit summary
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,999 edits
No edit summary
 
(478 intermediate revisions by 10 users not shown)
Line 1: Line 1:
==Inclined UV lamp==
{{cc-nanolab}}
[[Image:Opticoat.jpg|200×200px|right|thumb|The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.]]


The Inclined UV lamp is 1000 W Hg(Xe)lamp source designed for near UV, 350-450nm, mid UV, 260-320nm, and deep UV, 220-260nm exposures of resists and polymers. The exposure source can be also used to make an inclined exposure in air or in the media tank.
[[Category: Equipment|Lithography exposure]]
[[Category: Lithography|Exposure]]


The toll was purchased in February 2009 from Newport company. The exposure lamp has a official name: Oriel Flood Exposure Source, unit 92540. All other parts of equipment: inclined substrate and mask holder with media tank, exhaust box around the tool, timer controller, were designed and build at Danchip workshop.
__TOC__


The incleined substrate and mask holder with a media tank was designed as part of Master Thesis of DTU Nanotech
=UV Exposure Comparison Table=
{| class="wikitable"
|-
!
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MA6-1|Aligner: MA6-1]]
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MA6-2|Aligner: MA6-2]]
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA1|Aligner: Maskless 01]]
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA2|Aligner: Maskless 02]]
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA3|Aligner: Maskless 03]]
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA4|Aligner: Maskless 04]]
|-
! scope=row| Purpose
|
*Top side alignment
*Back side alignment
*UV exposure
NB: this tool is in PolyFabLab
|
*Top side alignment
*Back side alignment
*UV exposure
*Bond alignment
|
*Top side alignment
*Maskless UV exposure
|
*Top side alignment
*Back side alignment
*Maskless UV exposure
|
*Top side alignment
*Back side alignment
*Maskless UV exposure
|
*Top side alignment
*Maskless UV exposure
*Direct laser writing
NB: this tool is in PolyFabLab
|-
! scope=row| Minimum feature size
| ~1 µm || ~1 µm || ~1 µm || ~1 µm || ~1 µm || ~1 µm
|-
! scope=row| Alignment accuracy
|
*TSA: ±2 µm
*BSA: ±5 µm
|
*TSA: ±1 µm
*BSA: ±2 µm
|
±2 µm<br>(±1 µm possible)
|
*TSA: ± 0.5 µm
*BSA: ± 1 µm
|
*TSA: ± 0.5 µm
*BSA: ± 1 µm
|
±1 µm
|-
! scope=row| Exposure light source
|
*350 W Hg lamp
*i-line filter (365nm band pass filter)
|
*500 W Hg-Xe lamp
*i-line filter (365nm band pass filter)
|
365 nm LED
|
375 nm laser diode array
|
405 nm laser diode array
|
*365 nm LED
*405 nm laser diode
|-
! scope=row| Exposure mode
|
*Flood exposure
*Proximity
*Contact:
**Soft contact
**Hard contact
**Vacuum contact
|
*Flood exposure
*Proximity
*Contact:
**Soft contact
**Hard contact
**Vacuum contact
|
*Projection:
**Pneumatic auto-focus
|
*Projection:
**Optical auto-focus
**Pneumatic auto-focus
|
*Projection:
**Pneumatic auto-focus
|
*Projection:
**Optical auto-focus
**Pneumatic auto-focus
*Direct laser writing:
**Optical auto-focus
**Pneumatic auto-focus
|-
! scope=row| Batch size
| 1 || 1 || 1 || 1 || 1 || 1
|-
! scope=row| Allowed materials
| All PolyFabLab materials
|
*All cleanroom materials except copper and steel
*Dedicated chuck for III-V materials
| All cleanroom materials
| All cleanroom materials
| All cleanroom materials
| All PolyFabLab materials
|-
|}


=Mask vs Maskless aligners=
Comparison study between mask aligners and maskless aligners can be found [[Specific_Process_Knowledge/Lithography/Aligners/MAvsMLA|here]].


=Decommisioned tools=
<span style="color:red">Inclined UV lamp was decommissioned 2023.</span>


 
[[Specific Process Knowledge/Lithography/UVExposure/aligner_inclinedUV|Information about decommissioned tool can be found here.]]
 
 
 
 
 
There are 2 hotplates with temperature range up to 250C, placed in the same fumehood, which can be used for baking before/after spinning.
 
 
'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:'''
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=251 LabManager]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/UVExposure"