Jump to content

Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

← Older edit
VisualWikitext
Elkh (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
343 edits
No edit summary
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,527 edits
 
(470 intermediate revisions by 10 users not shown)
Line 1: Line 1:
==Inclined UV lamp==
{{cc-nanolab}}
[[Image:Opticoat.jpg|200×200px|right|thumb|The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.]]


The Inclined UV lamp is 1000 W Hg(Xe)lamp source designed for near UV, 350-450nm, mid UV, 260-320nm, and deep UV, 220-260nm exposures of resists and polymers. The exposure source can be also used to make an inclined exposure in air or in the media tank.
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/UVExposure click here]'''


The toll was purchased in February 2009 from Newport company. The exposure lamp has a official name: Oriel Flood Exposure Source, unit 92540. All other parts of equipment: inclined substrate and mask holder with media tank, exhaust box around the tool, timer controller, were designed and build at Danchip workshop.
[[Category: Equipment|Lithography exposure]]
[[Category: Lithography|Exposure]]


The incleined substrate and mask holder with a media tank was designed as part of Master Thesis of DTU Nanotech
__TOC__


=UV Exposure Comparison Table=




{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: MA6-1|Aligner: MA6-1]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Aligner: MA6-2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 03|Aligner: Maskless 03]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 04|Aligner: Maskless 04]]</b>
<!--|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>-->


|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Back Side Alignment
*UV exposure
OBS: this tool is in PolyFabLab
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Back Side Alignment
*UV exposure
*(DUV exposure)
*Bond alignment
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Maskless UV exposure
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Back Side Alignment
*Maskless UV exposure
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Back Side Alignment
*Maskless UV exposure
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Maskless UV exposure
*Direct laser writing
OBS: this tool is in PolyFabLab
<!--|style="background:WhiteSmoke; color:black"|
*UV exposure
*DUV exposure-->


|-
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Performance
|style="background:LightGrey; color:black"|Minimum feature size
|style="background:WhiteSmoke; color:black"|
~1 µm
|style="background:WhiteSmoke; color:black"|
~1 µm
|style="background:WhiteSmoke; color:black"|
~1 µm
|style="background:WhiteSmoke; color:black"|
~1 µm
|style="background:WhiteSmoke; color:black"|
~1 µm
|style="background:WhiteSmoke; color:black"|
~1 µm
<!--|style="background:WhiteSmoke; color:black"|-->


|-
|style="background:LightGrey; color:black"|Alignment accuracy
|style="background:WhiteSmoke; color:black"|
*TSA: ±2 µm
*BSA: ±5 µm
|style="background:WhiteSmoke; color:black"|
*TSA: ±1 µm
*BSA: ±2 µm
|style="background:WhiteSmoke; color:black"|
±2 µm<br>(±1 µm possible)
|style="background:WhiteSmoke; color:black"|
*TSA: ± 0.5 µm
*BSA: ± 1 µm
|style="background:WhiteSmoke; color:black"|
*TSA: ± 0.5 µm
*BSA: ± 1 µm
|style="background:WhiteSmoke; color:black"|
±1 µm
<!--|style="background:WhiteSmoke; color:black"|-->


|-
|style="background:LightGrey; color:black"|Exposure light
|style="background:WhiteSmoke; color:black"|
*350W Hg lamp
*i-line filter (365nm bandpass filter)
|style="background:WhiteSmoke; color:black"|
*500W Hg-Xe lamp
*i-line filter (365nm bandpass filter)
|style="background:WhiteSmoke; color:black"|
365nm LED
|style="background:WhiteSmoke; color:black"|
375nm laser diode array
|style="background:WhiteSmoke; color:black"|
405nm laser diode array
|style="background:WhiteSmoke; color:black"|
*365nm LED
*405nm laser diode
<!--|style="background:WhiteSmoke; color:black"|
*1000 W Hg-Xe lamp
*Dichroic mirror:
**Near UV (350-450nm)
**Mid UV (260-320nm)
**Deep UV (220-260nm)-->


There are 2 hotplates with temperature range up to 250C, placed in the same fumehood, which can be used for baking before/after spinning.
|-
|style="background:LightGrey; color:black"|Exposure mode
|style="background:WhiteSmoke; color:black"|
*Flood exposure
*Proximity
*Contact:
**Soft contact
**Hard contact
**Vacuum contact
|style="background:WhiteSmoke; color:black"|
*Flood exposure
*Proximity
*Contact:
**Soft contact
**Hard contact
**Vacuum contact
|style="background:WhiteSmoke; color:black"|
*Projection:
**Pneumatic auto-focus
|style="background:WhiteSmoke; color:black"|
*Projection:
**Optical auto-focus
**Pneumatic auto-focus
|style="background:WhiteSmoke; color:black"|
*Projection:
**Pneumatic auto-focus
|style="background:WhiteSmoke; color:black"|
*Projection:
**Optical auto-focus
**Pneumatic auto-focus
*Direct laser writing:
**Optical auto-focus
**Pneumatic auto-focus
<!--|style="background:WhiteSmoke; color:black"|
*Flood exposure
*Proximity exposure with home-made chuck and maskholder
*Inclined exposure
*Rotating exposure-->


|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*1 100 mm wafer
|style="background:WhiteSmoke; color:black"|
*1 small sample, down to 10x10 mm<sup>2</sup>
*1 50 mm wafer
*1 100 mm wafer
*1 150 mm wafer
|style="background:WhiteSmoke; color:black"|
*1 small sample, down to 5x5 mm<sup>2</sup>
*1 50 mm wafer
*1 100 mm wafer
*1 150 mm wafer (exposure area only 125x125 mm<sup>2</sup>)
|style="background:WhiteSmoke; color:black"|
*1 small sample, down to 3x3 mm<sup>2</sup>
*1 50 mm wafer
*1 100 mm wafer
*1 150 mm wafer
*1 200 mm wafer
|style="background:WhiteSmoke; color:black"|
*1 small sample, down to 5x5 mm<sup>2</sup>
*1 50 mm wafer
*1 100 mm wafer
*1 150 mm wafer
|style="background:WhiteSmoke; color:black"|
*1 small sample, down to 3x3 mm<sup>2</sup>
*1 50 mm wafer
*1 100 mm wafer
*1 150 mm wafer
<!--|style="background:WhiteSmoke; color:black"|
*all sizes up to 8inch-->


'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:'''
|-
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=251 LabManager]
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*All PolyFabLab materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except copper and steel
*Dedicated chuck for III-V materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials
|style="background:WhiteSmoke; color:black"|
*All PolyFabLab materials
<!--|style="background:WhiteSmoke; color:black"|
*All cleanroom materials-->
|-
|}
 
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MA6-1}}
 
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MA6-2}}
 
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA1}}
 
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA2}}
 
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA3}}
 
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA4}}
 
=Decommisioned tools=
<span style="color:red">Inclined UV lamp was decommissioned 2023.</span>
 
[[Specific Process Knowledge/Lithography/UVExposure/aligner_inclinedUV|Information about decommissioned tool can be found here.]]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/UVExposure"