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== UV Exposure Comparison Table ==
{{cc-nanolab}}


[[Category: Equipment|Lithography exposure]]
[[Category: Lithography|Exposure]]


{| border="2" cellspacing="0" cellpadding="2"
__TOC__
 
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#EVG Aligner|EVG Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>


=UV Exposure Comparison Table=
{| class="wikitable"
|-
!
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MA6-1|Aligner: MA6-1]]
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MA6-2|Aligner: MA6-2]]
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA1|Aligner: Maskless 01]]
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA2|Aligner: Maskless 02]]
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA3|Aligner: Maskless 03]]
! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA4|Aligner: Maskless 04]]
|-
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose  
! scope=row| Purpose
|style="background:LightGrey; color:black"|
|
|style="background:WhiteSmoke; color:black"|
*Top side alignment
*Spinning and baking of AZ5214E resist
*Back side alignment
*Spinning and baking of AZ4562 resist
*UV exposure
*Spinning and baking of e-beam resist
NB: this tool is in PolyFabLab
|style="background:WhiteSmoke; color:black"|
|
*Spinning and baking of AZ5214E resist
*Top side alignment
*Spinning and baking of AZ4562 resist
*Back side alignment
*Spinning and baking of SU8 resist
*UV exposure
|style="background:WhiteSmoke; color:black"|
*Bond alignment
*In-line substrate HMDS priming
*Coating and baking of AZ MiR 701 (29cps) resist
*Coating and baking of AZ nLOF 2020 resist
*Post-exposure baking at 110°C
|
|
 
*Top side alignment
*Maskless UV exposure
|
*Top side alignment
*Back side alignment
*Maskless UV exposure
|
*Top side alignment
*Back side alignment
*Maskless UV exposure
|
*Top side alignment
*Maskless UV exposure
*Direct laser writing
NB: this tool is in PolyFabLab
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
! scope=row| Minimum feature size
|style="background:LightGrey; color:black"|Substrate handling
| ~1 µm || ~1 µm || ~1 µm || ~1 µm || ~1 µm || ~1 µm
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Edge handling chuck
|style="background:WhiteSmoke; color:black"|
* Single substrate
* Non-vacuum chuck for fragile substrates
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
|Single substrate
|-
|-
|style="background:LightGrey; color:black"|Permanent media
! scope=row| Alignment accuracy
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* AZ4562 resist
* Acetone for chuck cleaning
* Acetone for drip pan
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* PGMEA for edge bead removal
* Acetone for chuck cleaning
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
* AZ nLOF 2020 resist
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
|
|
 
*TSA: ±2 µm
*BSA: ±5 µm
|
*TSA: ±1 µm
*BSA: ±2 µm
|
±2 µm<br>(±1 µm possible)
|
*TSA: ± 0.5 µm
*BSA: ± 1 µm
|
*TSA: ± 0.5 µm
*BSA: ± 1 µm
|
±1 µm
|-
|-
|style="background:LightGrey; color:black"|Manual dispense option
! scope=row| Exposure light source
|style="background:WhiteSmoke; color:black"|
|
* 2 automatic syringes
*350 W Hg lamp
|style="background:WhiteSmoke; color:black"|
*i-line filter (365nm band pass filter)
* yes
|
* pneumatic dispense for SU8 resist
*500 W Hg-Xe lamp
|style="background:WhiteSmoke; color:black"|
*i-line filter (365nm band pass filter)
* no
|
 
365 nm LED
|
375 nm laser diode array
|
405 nm laser diode array
|
*365 nm LED
*405 nm laser diode
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
! scope=row| Exposure mode
|style="background:LightGrey; color:black"|Spindle speed
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*10 - 9990 rpm
|
|
 
*Flood exposure
*10-5000 rpm
*Proximity
*Contact:
**Soft contact
**Hard contact
**Vacuum contact
|
*Flood exposure
*Proximity
*Contact:
**Soft contact
**Hard contact
**Vacuum contact
|
*Projection:
**Pneumatic auto-focus
|
*Projection:
**Optical auto-focus
**Pneumatic auto-focus
|
*Projection:
**Pneumatic auto-focus
|
*Projection:
**Optical auto-focus
**Pneumatic auto-focus
*Direct laser writing:
**Optical auto-focus
**Pneumatic auto-focus
|-
|-
|style="background:LightGrey; color:black"|Parameter 2
! scope=row| Batch size
|style="background:WhiteSmoke; color:black"|
| 1 || 1 || 1 || 1 || 1 || 1
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|
 
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row| Allowed materials
|style="background:LightGrey; color:black"|Batch size
| All PolyFabLab materials
|style="background:WhiteSmoke; color:black"|
*<nowiki>24</nowiki> 50 mm wafers
*<nowiki>24</nowiki> 100 mm wafers
*<nowiki>24</nowiki> 150 mm wafers
|style="background:WhiteSmoke; color:black"|
*<nowiki>1</nowiki> 100 mm wafer
*<nowiki>1</nowiki> 150 mm wafer
|style="background:WhiteSmoke; color:black"|
*<nowiki>25</nowiki> 100 mm wafers
|
|
 
*All cleanroom materials except copper and steel
* Maximum substrate size: 6"
*Dedicated chuck for III-V materials
* Minimum substrate size: 3*3 mm2
| All cleanroom materials
* maximum substrate thickness: 4 mm
| All cleanroom materials
| All cleanroom materials
| All PolyFabLab materials
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|style="background:WhiteSmoke; color:black"|
*Silicon
*Glass
|
*III-V compound semiconductors
*Si, SiO2, SOI
|-
|}
|}


<br clear="all" />
=Mask vs Maskless aligners=
 
Comparison study between mask aligners and maskless aligners can be found [[Specific_Process_Knowledge/Lithography/Aligners/MAvsMLA|here]].
== KS Aligner ==
 
== EVG Aligner ==
 
== III-V Aligner ==
 
 
 
==Inclined UV lamp==
[[Image:Inclined UV lamp_1.jpg|200×200px|right|thumb|Inclined UV lamp is placed in Cleanroom 13.]]
 
The Inclined UV lamp is 1000 W Hg(Xe)lamp source designed for near UV, 350-450nm, mid UV, 260-320nm, and deep UV, 220-260nm exposures of resists and polymers. The exposure source can be also used to make an inclined exposure in air or in the media tank.
 
The toll was purchased in February 2009 from Newport company. The exposure lamp has a official name: Oriel Flood Exposure Source, unit 92540. All other parts of equipment: substrate and mask holder with media tank, exhaust box around the tool, timer controller, were designed and build at Danchip workshop.
 
The substrate and mask holder with a media tank was designed as part of Master Thesis of DTU Nanotech, Andres Kristensen group. The exhaust box was made as part of safety and the timer controller was build to control exposure time.  


The technical specification and the general outline of the equipment can be found in LabManager.  
=Decommisioned tools=
<span style="color:red">Inclined UV lamp was decommissioned 2023.</span>


'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:'''
[[Specific Process Knowledge/Lithography/UVExposure/aligner_inclinedUV|Information about decommissioned tool can be found here.]]
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&page_id=169 LabManager]

Latest revision as of 14:38, 26 June 2026

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

UV Exposure Comparison Table

Aligner: MA6-1 Aligner: MA6-2 Aligner: Maskless 01 Aligner: Maskless 02 Aligner: Maskless 03 Aligner: Maskless 04
Purpose
  • Top side alignment
  • Back side alignment
  • UV exposure

NB: this tool is in PolyFabLab

  • Top side alignment
  • Back side alignment
  • UV exposure
  • Bond alignment
  • Top side alignment
  • Maskless UV exposure
  • Top side alignment
  • Back side alignment
  • Maskless UV exposure
  • Top side alignment
  • Back side alignment
  • Maskless UV exposure
  • Top side alignment
  • Maskless UV exposure
  • Direct laser writing

NB: this tool is in PolyFabLab

Minimum feature size ~1 µm ~1 µm ~1 µm ~1 µm ~1 µm ~1 µm
Alignment accuracy
  • TSA: ±2 µm
  • BSA: ±5 µm
  • TSA: ±1 µm
  • BSA: ±2 µm

±2 µm
(±1 µm possible)

  • TSA: ± 0.5 µm
  • BSA: ± 1 µm
  • TSA: ± 0.5 µm
  • BSA: ± 1 µm

±1 µm

Exposure light source
  • 350 W Hg lamp
  • i-line filter (365nm band pass filter)
  • 500 W Hg-Xe lamp
  • i-line filter (365nm band pass filter)

365 nm LED

375 nm laser diode array

405 nm laser diode array

  • 365 nm LED
  • 405 nm laser diode
Exposure mode
  • Flood exposure
  • Proximity
  • Contact:
    • Soft contact
    • Hard contact
    • Vacuum contact
  • Flood exposure
  • Proximity
  • Contact:
    • Soft contact
    • Hard contact
    • Vacuum contact
  • Projection:
    • Pneumatic auto-focus
  • Projection:
    • Optical auto-focus
    • Pneumatic auto-focus
  • Projection:
    • Pneumatic auto-focus
  • Projection:
    • Optical auto-focus
    • Pneumatic auto-focus
  • Direct laser writing:
    • Optical auto-focus
    • Pneumatic auto-focus
Batch size 1 1 1 1 1 1
Allowed materials All PolyFabLab materials
  • All cleanroom materials except copper and steel
  • Dedicated chuck for III-V materials
 All cleanroom materials All cleanroom materials All cleanroom materials All PolyFabLab materials

Mask vs Maskless aligners

Comparison study between mask aligners and maskless aligners can be found here.

Decommisioned tools

Inclined UV lamp was decommissioned 2023.

Information about decommissioned tool can be found here.

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