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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development click here]'''
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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Development click here]'''


== Automatic Developer Bench for 4" and 6" ==
[[Category: Equipment|Lithography development]]
[[Category: Lithography|Development]]


Write a short description of the equipment(s).
__TOC__


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
=Development Comparison Table=
<!-- remember to remove the type of documents that are not present -->
{| class="wikitable"
|-
!
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]
|-
! scope=row style="text-align: left;" |  Purpose
|
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools


[[image:Cluster1.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
<span style="color:red">Requires individual risk assessment for TMAH development!</span>
|
Development of:
*SU-8
|
Development of:
*ZEP 520A
*AR-P 6200.xx (CSAR)
|
Development of:
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
*DUV resists
|
Development of:
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
*DUV resists
Post-exposure baking
|
Development of:
*DUV resists
Post-exposure baking
|-
! scope=row style="text-align: left;" | Developer
| Process dependent
| mr-Dev 600 (PGMEA)
|  
*ZED N-50
*AR 600-50
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
|-
! scope=row style="text-align: left;" | Method
| Submersion
| Submersion
| Puddle
| Puddle
| Puddle
| Puddle
|-
! scope=row style="text-align: left;" | Handling
|
Manual handling in beakers
*Chip bucket
*Single wafer carrier
*Carrier for up to 5 wafers
|
*Chip bucket
*Single wafer carrier
*Carrier for up to 6 wafers
|
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 50 mm substrates
|
*Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
*Chip chuck for chips & 50 mm substrates
| Vacuum chuck
| Vacuum chuck
|-
! scope=row style="text-align: left;" | Process temperature
| Room temperature
| Room temperature
| Room temperature
| Room temperature
| Room temperature
| Room temperature
|-
! scope=row style="text-align: left;" | Process agitation
| No agitation allowed
| Magnetic stirrer
| Rotation
| Rotation
| Rotation
| Rotation
|-
! scope=row style="text-align: left;" | Process rinse
| Process dependent
| IPA
| IPA
| DI water
| DI water
| DI water
|-
! scope=row style="text-align: left;" | Substrate size
|
* Chips
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
|
* Chips
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers
|
* Chips (5mm to 2")
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers
|
* Chips (5mm to 50 mm)
* 100 mm wafers
* 150 mm wafers
|
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|-
! scope=row style="text-align: left;" | Allowed materials
| All cleanroom approved materials
|
*Silicon and glass substrates
*Film or pattern of all but Type IV
| All cleanroom approved materials
|
*All cleanroom approved materials
*Film or pattern of all types
|
*Silicon and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|
*Silicon, III-V, and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|-
! scope=row style="text-align: left;" | Batch size
| 1 - 5
| 1 - 6
| 1
| 1
| 1 - 25
| 1 - 25
|}
<br clear="all" />


<!-- give the link to the equipment info page in LabManager: -->
<!--
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=316 LabManager]
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
-->
<!--
{{:Specific Process Knowledge/Lithography/Development/beaker_developer}}


== Name of equipment ==
{{:Specific Process Knowledge/Lithography/Development/SU8_developer}}


Write a short description of the equipment(s).
{{:Specific Process Knowledge/Lithography/Development/manualEbeam_developer}}


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
{{:Specific Process Knowledge/Lithography/Development/manualTMAH_developer}}
<!-- remember to remove the type of documents that are not present -->


[[image:Cluster1.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
{{:Specific Process Knowledge/Lithography/Development/UV_developer}}


<!-- give the link to the equipment info page in LabManager: -->
{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=316 LabManager]
-->


== Process information ==
=Decommisioned tools=
<span style="color:red">Developer 1 & 2 were decommissioned 2017-01.</span>


Link to process pages - e.g. one page for each material
[[Specific Process Knowledge/Lithography/Development/1and2_developer|Information about decommissioned tool can be found here.]]


Example:
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]]


==Equipment performance and process related parameters==
<span style="color:red">Developer 6 inch was decommissioned 2019-12.</span>


{| border="2" cellspacing="0" cellpadding="2"
[[Specific Process Knowledge/Lithography/Development/6inch_developer|Information about decommissioned tool can be found here.]]
 
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b>
|style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Purpose 1
*Purpose 2
|style="background:WhiteSmoke; color:black"|
*Purpose 1
*Purpose 2
*Purpose 3
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Response 1
|style="background:WhiteSmoke; color:black"|
*Performance range 1
*Performance range 2
|style="background:WhiteSmoke; color:black"|
*Performance range 1
*Performance range 2
*Performance range 3
|-
|style="background:LightGrey; color:black"|Response 2
|style="background:WhiteSmoke; color:black"|
*Performance range
|style="background:WhiteSmoke; color:black"|
*Performance range
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Parameter 1
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|-
|style="background:LightGrey; color:black"|Parameter 2
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|-
|}
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