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{{:Specific Process Knowledge/Lithography/authors_generic}}
{{cc-nanolab}}


'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/LiftOff click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/LiftOff click here]'''
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=Lift-off Comparison Table=
=Lift-off Comparison Table=


{| border="2" cellspacing="0" cellpadding="2"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off (wet bench 07)]]</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=370 Fume hood 03: Solvents]</b> - '''requires login'''
|style="background:WhiteSmoke; color:black" align="center"|<b>[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=370 Fume hood 03: Solvents]</b> - '''requires login'''
|-
|-
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|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
NMP (Remover 1165) / Rinse in IPA
Lift-off bath with NMP (Remover 1165)
 
Rinse bath with diluted IPA
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
User defined
User defined
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At the DTU Nanolab cleanroom facility, it is only allowed to do lift-off in:
At the DTU Nanolab cleanroom facility, it is only allowed to do lift-off in:
*<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off (Wet bench 07)]]</b>
*<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off (Wet bench 07)]]</b>
*<b>[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=370 Fume hood 03: Solvents]</b>
*<b>[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=370 Fume hood 03: Solvents]</b> - '''requires login'''
Other fume hoods, such as Fume hood 04: Solvents, Fume hood 09: UV development, and Fume hood 10: e-beam development, should not be used for lift-off. For an overview of the fume hoods, click [[Specific_Process_Knowledge/Overview_of_Fume_Hoods|'''here''']].
Other fume hoods, such as Fume hood 04: Solvents, Fume hood 09: UV development, and Fume hood 10: e-beam development, should not be used for lift-off. For an overview of the fume hoods, click [[Specific_Process_Knowledge/Overview_of_Fume_Hoods|'''here''']].
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=Lift-off at Nanolab=
{{:Specific Process Knowledge/Lithography/LiftOff/liftoff_wetbench07}}
 
==Lift-off wet bench 07==
[[Image:Lift_off.jpg|300x300px|thumb|Lift-off wet bench in D-3]]
 
'''The user manual, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=384 LabManager]'''
 
 
{| border="2" cellspacing="0" cellpadding="2"
 
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]</b>
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!style="background:silver; color:black;" align="center"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Lift-off using UV resists, e.g.
** AZ 5214E lift-off
** AZ nLOF lift-off
*Lift-off using e-beam resists, e.g.
** CSAR 62
*Resist strip of wafers with metal
|-
!style="background:silver; color:black;" align="center"|Bath chemical
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
NMP (Remover 1165) / Rinse in IPA
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Process temperature
|style="background:WhiteSmoke; color:black" align="center"|
Heating of the bath is possible.
 
The heating has been limited to 60°C
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|style="background:LightGrey; color:black"|Ultrasonic agitation
|style="background:WhiteSmoke; color:black" align="center"|
Continuous or pulsed
 
The power may be varied
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
Silicon or glass wafers
 
Film or patterning of all but Type IV (Pb, Te)
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|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1 - 25
|-
|}
 
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=== Process information ===
Lift-off is used for lift-off using resists that are soluble in NMP (''N''-Methyl-Pyrrolidone), supplied in the cleanroom as "Remover 1165". Both AZ 5214E and AZ nLOF are soluble in NMP.
 
For information on processing of AZ nLOF, or image reversal of AZ 5214E, see here: [[Specific_Process_Knowledge/Lithography/Resist/UVresist|Resist Overview]].
 
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