Specific Process Knowledge/Lithography: Difference between revisions

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{{cc-nanolab}}
[[Image:DUV_wafers.jpg|250x250px|right|frame|]]


'''Feedback to this page''': '''[mailto:photolith@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
<!-- Replace "http://labadviser.nanolab.dtu.dk/..." with the link to the Labadviser page-->


[[Category: Equipment |Lithography]]
[[Category: Equipment|Lithography]]
[[Category: Lithography]]
 
[[Image:DUV_wafers.jpg|500px|frameless|right|]]


__TOC__
__TOC__
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*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]  
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]  
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=Comparing lithography methods at DTU Nanolab=
=Comparing lithography methods at DTU Nanolab=


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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|Pattern transfer via UltraViolet (UV) light
|Pattern transfer via ultraviolet (UV) light
|Pattern transfer via Deep UltraViolet (DUV) light
|Pattern transfer via deep ultraviolet (DUV) light
|Patterning by electron beam
|Patterning by electron beam
|Pattern transfer via hot embossing (HE)
|Pattern transfer via hot embossing (HE)
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!Pattern size range
!Pattern size range
|
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*Resist type, thickness, and pattern dependent
~0.6 µm and up<br>
*~0.6 µm and up
(resist type, thickness, and pattern dependent)
|
|
*pattern type, shape and pitch dependent
~200 nm and up<br>
*~200 nm and up
(pattern type, shape and pitch dependent)
|
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*~12 nm - 1 µm (and larger at high currents)
~12 nm - 1 µm<br>
(and larger at high currents)
|
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*~20 nm and up
~20 nm and up
|-
|-


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!Resist type
!Resist type
|
|
*UV sensitive:
UV sensitive:
**AZ 5214E, AZ 4562, AZ MiR 701 (positive)
*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
**AZ 5214E, AZ nLOF 2020, SU-8 (negative)
*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|
|
*DUV sensitive
DUV sensitive
**JSR KRF M230Y, JSR KRF M35G (positive)
*JSR KRF M230Y, JSR KRF M35G (positive)
**UVN2300-0.8 (negative)
*UVN2300-0.8 (negative)
|
|
*E-beam sensitive
E-beam sensitive
**AR-P6200 CSAR, ZEP502A , PMMA (positive)
*AR-P6200 CSAR, ZEP502A , PMMA (positive)
**HSQ, mr-EBL, AR-N 7520 (negative)
*HSQ, mr-EBL, AR-N 7520 (negative)
|
|
*Imprint polymers:
Imprint polymers:
**Topas
*Topas
**PMMA
*PMMA
**mr-I 7030R
*mr-I 7030R
|-
|-


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!Resist thickness range
!Resist thickness range
|
|
~0.5µm to 200µm
~0.5 µm to 200 µm
|
|
~50nm to 2µm
~50 nm to 2 µm
|
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~30nm to 1 µm
~30 nm to 1 µm
|
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~ 100nm to 2µm
~ 100 nm to 2 µm
|-
|-


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!Typical exposure time
!Typical exposure time
|
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10s-3min pr. wafer using mask aligners.
10 s - 3 min pr. wafer using mask aligners<br>
 
10 min - 5 hours pr. wafer using maskless aligners
10min-5hours pr. wafer using maskless aligners.
|
|
Process depended, depends on pattern, pattern area and dose.
Process dependent:
*Pattern
*Pattern area
*Dose


Throughput is up to 60 wafers/hour.
Throughput is up to 60 wafers/hour
|
|
Depends on dose, Q [µC/cm<sup>2</sup>], beam current, I [A], and pattern area, A [cm<sup>2</sup>]:
Process dependent:
*Dose, Q [µC/cm<sup>2</sup>]
*Beam current, I [A]
*Pattern area, a [cm<sup>2</sup>]


t = Q*A/I
time [s] = Q*a/I
|
|
Process depended, depends also on heating and cooling temperature rates
Process dependent, including heating/cooling rates
|-
|-


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!Substrate size
!Substrate size
|
|
*small samples, down to 3x3 mm<sup>2</sup>
*chips down to 3 mm x 3 mm
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
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*200 mm wafers
*200 mm wafers
|
|
We have cassettes that fit to
We have cassettes fitting:
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*6 wafers of 50 mm in size
*6 wafers of 50 mm in size
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!'''Allowed materials'''
!'''Allowed materials'''
|
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*Any standard cleanroom material  
Any standard cleanroom material  
|
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*Any standard cleanroom material  
Any standard cleanroom material  
|
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*Any standard cleanroom material, except materials that will degas and special treatment for graphene  
Any standard cleanroom material, except:
*Materials that will degas
*Graphene requires special treatment   
|
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*Any standard cleanroom material  
Any standard cleanroom material  
|-
|-
|}
|}
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=Equipment Pages=
=Equipment Pages=


{| style="color: black;" width="90%"
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|-
|-
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'''<big>Resist</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Resist|Resist]]</big>'''
*[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|UV Resist Overview]]
*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper|DUV Resists]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists|E-beam resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#DUV_Resist|DUV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#E-beam_Resist|E-beam Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]


'''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
*[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Drop Shape Analyzer]]


'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Labspin 02/03]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin coater: Süss Stepper]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin coater: Süss Stepper]]
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*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]


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'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]</big>'''
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: MA6 - 1|Aligner: MA6 - 1]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6-2]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6-2]]
*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV-lamp]]
<!--*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV-lamp]]-->
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]
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'''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ|E-Beam Writer 9500 (JEOL JBX-9500FSZ)]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/RaithElphy|Raith Elphy on SEM - LEO]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]


'''<big>[[Specific_Process_Knowledge/Imprinting|NanoImprint Lithography]]</big>'''
'''<big>[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]</big>'''
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]




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| style="width: 20%"; valign="top"|
'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]
*[[Specific Process Knowledge/Lithography/Development#SU8-Developer|Developer: SU8]]
*[[Specific Process Knowledge/Lithography/Development#Developer:_SU8_(wetbench)|Developer: SU8 (wetbench)]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper|Developer: TMAH Stepper]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer: E-beam]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer: E-beam]]


'''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>'''
*[[Specific Process Knowledge/Lithography/Strip#Plasma_asher|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3:Descum]]
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]


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'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
*[[Specific Process Knowledge/Lithography/Strip#Plasma_asher|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]]
*[[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]]
|}
|}
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=Lithography Tool Package Training=
=Lithography Tool Package Training=


DTU Nanolab offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment. After the TPT has been successfully completed, you can begin training on the lithography equipment at DTU Nanolab.


DTU Nanolab offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment, as well as training in equipment operation and processing in the cleanroom.  
You are required to pass this course, in order to get access to using the lithography equipment inside the DTU Nanolab fabrication facility (The Cleanroom).


The course is for all users that intend to perform any kind of lithographic processing in the cleanroom, and is a prerequisite for training in other lithography equipment.
For details, dates, and course material, please check the course description under [[LabAdviser/Courses#The_Lithography_TPT|Courses]].




'''For details, dates, and course material, please check the course description under [[LabAdviser/Courses#The_Lithography_TPT|Courses]].'''
'''Signing up for the course'''


The course is in DTU Learn. You sign up for the course by enrolling yourself in the course [https://learn.inside.dtu.dk/d2l/le/discovery/view/course/56077 DTU Nanolab TPT: Lithography] - '''requires login'''
* Watch the lecture videos
* Successfully complete all the quizzes


{|border="1" cellspacing="0" cellpadding="3" align="left" style="text-align:left;" style="width: 70%;"
|-


|-
'''Learning objectives'''
|-style="background:White; color:black; text-align:center"
!colspan="2"|Lithography Tool Package Training
|-


|-
Learn about the fundamentals of lithography processing in a cleanroom fabrication lab:
!Schedule
* Coating
|
* Exposure
<!--'''<span style="color: red;">OBS: The December Litho TPT has been cancelled due to sickness. Contact the Lithography Group for rescheduling if this poses a problem.</span>''' <span style="text-decoration: line-through;">'''NEXT LECTURE: Tuesday 29th of November 9:15 - 13:00 (B347, Seminar room)'''</span>-->
* Development
'''Theoretical part'''
* Resist, substrates and pre-treatment
* Lecture videos that can be viewed at one's leisure.
* Post-lithography steps
* A 1 hour "questions and exercises" session 2 times a month (typically Fridays 09:30-10:30).
<!--* NEXT "questions and exercises" sessions: '''24th of March, 31st of March, 21st of April, 28th of April, 19th of May'''-->
'''Practical part'''
* A 3-4 hour training session 2 times a month, max. 4 persons per session (typically Wednesdays 09:00 - 12:30 or 10:00 - 13:30).
<!--* NEXT training sessions: '''29th of March, 5th of April, 26th of April, 3rd of May, 24th of May'''-->
* This part is not mandatory, and may be replaced by individual trainings if relevant.
|-


|-
!Location
|
'''Theoretical part'''
* The location of the "questions and exercises" session is room 121A in building 345C.
'''Practical part'''
* The training session takes place inside the cleanroom. The meeting point will be in front of the first equipment.
|-


|-
'''After completing the TPT'''
!Qualified Prerequisites
|
* Cleanroom safety course at DTU Nanolab
* Admission to the cleanroom must be obtained before the training session
* Theoretical part must be completed before the training session
|-
 
|-
!Preparations
|
'''Before the "questions and exercises" session'''
* Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus)
* Watch the lecture videos (7 videos, 2:41 hours in total). Write down any questions that may arise during the videos.
'''Before training session'''
* Complete the theoretical part (Q&E)
* Watch the training videos of spin coating (automatic), exposure (operation, and alignment), and development (automatic).
* Study the equipment manuals. The manuals are available in LabManager.
* Study the TPT process flows (first print, and alignment).
<!--'''Links to literature, lecture videos, training videos, equipment manuals, and process flows can be found in the "Knowledge and Information" section below.'''-->
|-
 
|-
!Course Responsible
|
The Lithography Group at DTU Nanolab [mailto:lithography@nanolab.dtu.dk lithography@nanolab.dtu.dk].
|-
 
|-
!Learning Objectives
|
* Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
* Authorization to use spin coater, mask aligner, and developer at DTU Nanolab
* Calculate relevant process parameters
* Analyze and apply your results of lithographic processing
|-
 
|}


When all TPT quizzes have been completed successfully, you have finished the lithography TPT, and can begin the online training on the lithography equipment you need to use. The online training is available in the course [https://learn.inside.dtu.dk/d2l/le/discovery/view/course/118192 DTU Nanolab: lithography equipment training] - '''requires login'''


After completing the online equipment training, you become eligible for the hands-on authorization training, which will take place inside the cleanroom.
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| colspan="3" |  
|-
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'''<big>Literature</big>'''
'''<big>Literature</big>'''
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
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'''<big>Lecture videos</big>'''
'''<big>Lecture videos</big>'''
*Lithography TPT lecture videos (7 videos, 2:41 hours in total) on [http://podcast.llab.dtu.dk/index.php?id=302 DTU Podcasts] or [https://www.youtube.com/watch?v=hMgpRSOokxE&list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
*Lithography TPT lecture videos:
**Current version (6 videos, 1:28 hours:minutes in total) on [https://www.youtube.com/playlist?list=PLjWVU97LayHCp7x9OujmVlZWLAnK4CDFR YouTube]
**Old version (7 videos, 2:41 hours in total) on [https://www.youtube.com/watch?v=hMgpRSOokxE&list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
*A full [https://www.youtube.com/watch?v=TdwUGOxCdUc&index=39&list=PLM2eE_hI4gSDjK4SiDbhpmpjw31Xyqfo_ lecture series] from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)
*A full [https://www.youtube.com/watch?v=TdwUGOxCdUc&index=39&list=PLM2eE_hI4gSDjK4SiDbhpmpjw31Xyqfo_ lecture series] from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)


 
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'''<big>Lithography TPT lecture slides</big>'''
<!-- Removed by TARAN 2024-09-27
*[[:Media:Litho_Tool_Package_-_Introduction.pdf|TPT slides: Introduction]]
'''<big>Lithography TPT lecture slides</big>'''<br>
*[[:Media:Litho_Tool_Package_-_Spin_coating.pdf‎|TPT slides: Spin Coating]]
''' NB: Access to slides require login'''
*[[:Media:Litho_Tool_Package_-_Exposure.pdf|TPT slides: UV Exposure]]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Introduction.pdf TPT slides: Introduction]
*[[:Media:Litho_Tool_Package_-_Development.pdf‎|TPT slides: Development]]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Spin_coating.pdf TPT slides: Spin Coating]
*[[:Media:Litho_Tool_Package_-_Post_processing.pdf‎|TPT slides: Post-processing]]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Exposure.pdf TPT slides: UV Exposure]
*[[:Media:Litho_Tool_Package_-_Process_effects_and_examples.pdf|TPT slides: Process Effects and Examples]]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Development.pdf TPT slides: Development]
 
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Post_processing.pdf TPT slides: Post-processing]
| style="width: 20%"|
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Process_effects_and_examples.pdf TPT slides: Process Effects and Examples]
-->


'''<big>Training videos</big>'''
'''<big>Training videos</big>'''
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*[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training Video: Automatic Puddle Developer]
*[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training Video: Automatic Puddle Developer]
*[https://www.youtube.com/watch?v=btinNzYnLnY Training Video: Manual Puddle Developer]
*[https://www.youtube.com/watch?v=btinNzYnLnY Training Video: Manual Puddle Developer]
Playlists on YouTube:
'''Playlists on YouTube:'''
*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHCX4sz2AH_YiPbNRmkrBYe5 Lithography TPT training videos]
*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Maskless aligner training videos]
*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Maskless aligner training videos]
*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHCX4sz2AH_YiPbNRmkrBYe5 Old Lithography TPT training videos]




 
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'''<big>Manuals</big>'''
'''<big>Manuals</big>'''<br>
'''NB: Access to manuals require login'''
*Automatic Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 Spin Coater: Gamma UV]
*Automatic Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 Spin Coater: Gamma UV]
*Manual Spin Coater: [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=362 Spin Coater: Labspin 02] or [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=387 Spin Coater: Labspin 03]
*Manual Spin Coater: [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=362 Spin Coater: Labspin 02] or [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=387 Spin Coater: Labspin 03]
Line 371: Line 329:
*Manual E-beam Developer: [http://labmanager.dtu.dk/d4Show.php?id=5070&mach=341 Developer: E-beam Manual]
*Manual E-beam Developer: [http://labmanager.dtu.dk/d4Show.php?id=5070&mach=341 Developer: E-beam Manual]


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'''<big>Process Flows</big>'''
'''<big>Process Flows</big>'''
*[[:Media:Process_Flow_TPT first print.pdf|TPT first print process flow]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_resist_comparison_table|UV resist process flows]]
*[[:Media:Process_Flow_TPT alignment.pdf|TPT alignment process flow]]
*[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|UV resist process flows]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_flow|E-beam resist process flows]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_flow|E-beam resist process flows]]
 
*[[:Media:Process_Flow_TPT first print.pdf|Old TPT process flow (first print)]]
 
*[[:Media:Process_Flow_TPT alignment.pdf|Old TPT process flow (alignment)]]
'''<big>Resists</big>'''
*[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|UV Resist Overview]] (links to manufacturers, technical data, process flows, etc)
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper|DUV Resists]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists|E-beam Resist Overview]]
 
 
'''<big>UV Exposure</big>'''
*[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|Information on UV Exposure Dose]]
 
 
'''<big>Electron Beam Exposure</big>'''
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ#Getting_started|Training on JEOL JBX-9500FSZ]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_flow|E-beam resists and process flows]]
*[[:File:Lecture E-beam Lithography -LGPE.pdf|Lecture on E-beam Lithography]]
 
 
'''<big>Deep-UV Exposure</big>'''
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Stepper Lithography]]
 
|}
|}
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Latest revision as of 15:50, 13 November 2024

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

Feedback to this page: click here

There are four different types of lithography available at DTU Nanolab:


Comparing lithography methods at DTU Nanolab

UV Lithography DUV Stepper Lithography E-beam Lithography Nano Imprint Lithography
Generel description Pattern transfer via ultraviolet (UV) light Pattern transfer via deep ultraviolet (DUV) light Patterning by electron beam Pattern transfer via hot embossing (HE)
Pattern size range

~0.6 µm and up
(resist type, thickness, and pattern dependent)

~200 nm and up
(pattern type, shape and pitch dependent)

~12 nm - 1 µm
(and larger at high currents)

~20 nm and up

Resist type

UV sensitive:

  • AZ 5214E, AZ 4562, AZ MiR 701 (positive)
  • AZ 5214E, AZ nLOF 2020, SU-8 (negative)

DUV sensitive

  • JSR KRF M230Y, JSR KRF M35G (positive)
  • UVN2300-0.8 (negative)

E-beam sensitive

  • AR-P6200 CSAR, ZEP502A , PMMA (positive)
  • HSQ, mr-EBL, AR-N 7520 (negative)

Imprint polymers:

  • Topas
  • PMMA
  • mr-I 7030R
Resist thickness range

~0.5 µm to 200 µm

~50 nm to 2 µm

~30 nm to 1 µm

~ 100 nm to 2 µm

Typical exposure time

10 s - 3 min pr. wafer using mask aligners
10 min - 5 hours pr. wafer using maskless aligners

Process dependent:

  • Pattern
  • Pattern area
  • Dose

Throughput is up to 60 wafers/hour

Process dependent:

  • Dose, Q [µC/cm2]
  • Beam current, I [A]
  • Pattern area, a [cm2]

time [s] = Q*a/I

Process dependent, including heating/cooling rates

Substrate size
  • chips down to 3 mm x 3 mm
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers

We have cassettes fitting:

  • 4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
  • 6 wafers of 50 mm in size
  • 3 wafers of 100 mm in size
  • 1 wafer of 150 mm in size
  • 1 wafer of 200 mm in size

Only one cassette can be loaded at a time

  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials

Any standard cleanroom material

Any standard cleanroom material

Any standard cleanroom material, except:

  • Materials that will degas
  • Graphene requires special treatment

Any standard cleanroom material


Equipment Pages

Resist

Pretreatment

Coating

Baking

UV Exposure Tools

Deep-UV Exposure

Electron Beam Exposure

Nano Imprint Lithography


Development

Descum

Lift-off

Strip


Lithography Tool Package Training

DTU Nanolab offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment. After the TPT has been successfully completed, you can begin training on the lithography equipment at DTU Nanolab.

You are required to pass this course, in order to get access to using the lithography equipment inside the DTU Nanolab fabrication facility (The Cleanroom).

For details, dates, and course material, please check the course description under Courses.


Signing up for the course

The course is in DTU Learn. You sign up for the course by enrolling yourself in the course DTU Nanolab TPT: Lithography - requires login

  • Watch the lecture videos
  • Successfully complete all the quizzes


Learning objectives

Learn about the fundamentals of lithography processing in a cleanroom fabrication lab:

  • Coating
  • Exposure
  • Development
  • Resist, substrates and pre-treatment
  • Post-lithography steps


After completing the TPT

When all TPT quizzes have been completed successfully, you have finished the lithography TPT, and can begin the online training on the lithography equipment you need to use. The online training is available in the course DTU Nanolab: lithography equipment training - requires login

After completing the online equipment training, you become eligible for the hands-on authorization training, which will take place inside the cleanroom.

Knowledge and Information about Lithography

Literature


Lecture videos

  • Lithography TPT lecture videos:
    • Current version (6 videos, 1:28 hours:minutes in total) on YouTube
    • Old version (7 videos, 2:41 hours in total) on YouTube
  • A full lecture series from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)

Training videos

Playlists on YouTube:


Manuals
NB: Access to manuals require login


Process Flows


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