Specific Process Knowledge/Etch: Difference between revisions
Line 65: | Line 65: | ||
*[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | *[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | ||
*[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | *[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | ||
*[[/DRIE-Pegasus| DRIE-Pegasus 1 | *[[/DRIE-Pegasus| DRIE-Pegasus systems]] | ||
**[[/DRIE-Pegasus/Pegasus-1| DRIE-Pegasus 1 (Si etching on 4" wafers)]] | |||
**[[/DRIE-Pegasus/Pegasus-2| DRIE-Pegasus 2 (Tool dedicated to research)]] | |||
**[[/DRIE-Pegasus/Pegasus-3| DRIE-Pegasus 3 (Si etching on 150 mm wafers)]] | |||
**[[/DRIE-Pegasus/Pegasus-4| DRIE-Pegasus 4 (Etching of silicon based dielectrics on 150 mm wafers)]] | |||
*[[/ICP Metal Etcher|ICP Metal Etch]] | *[[/ICP Metal Etcher|ICP Metal Etch]] | ||
*[[/III-V ICP|III-V ICP]] | *[[/III-V ICP|III-V ICP]] |
Revision as of 10:43, 4 November 2020
Feedback to this page: click here
Wet etch or dry etch
Etching at Nanolab Fabrication can be done either with wet chemistry or in dry etch equipment. In general wet chemistry etches isotropically in most materials were as dry etch techniques can be optimized to transfer a given mask pattern with vertical sidewalls (anisotropically) to a given substrate.
Advantages of wet chemistry over dry etch techniques are:
- An often high etch rate difference of different materials giving raise to a high selectivity of the material to be etched compared to underlaying layers or mask materials.
- Time saving: You can often etch 25 wafers at a time in wet chemistry where as dry etch equipment can only handle one wafer at a time.
- Easy to start up new etch solutions.
Advantages of dry etch over wet chemistry:
- Anisotropic etch can be done.
- The etch does not attack the backside of the sample.
Dry etch Tool Package Training
Choose material to be etched
Dry etching of III-V materials and exotic materials in some other European Cleanroom facility
Dielectrica | Semicondutors | Metals | Alloys | Polymers |
|
|
Choose Method/Equipment for the Etch
A Dry Etch Equipment | A Wet Etch |
|