Specific Process Knowledge/Thin film deposition

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Choose material to deposit

Semiconductors	Oxides	Nitrides	Carbon and Carbides	Metals	Alloys	Transparent conductive oxides	Polymers	Multilayers
Silicon Germanium	Aluminium Oxide (Al2O3) Barium titanate (BaTiO3) Chromium Oxide (Cr2O3) Hafnium Oxide (HfO2) Magnesium Oxide (MgO) Nickel Oxide (NiO) Silicon Oxide (SiO2) Titanium Oxide (TiO2) Tantalum Oxide (Ta2O5) Vanadium Oxide (VOx) Zinc Oxide (ZnO)	Silicon Nitride - and oxynitride Titanium Nitride - conductive ceramics Niobium Titanium Nitride - superconductors Niobium Nitride (NbN) - superconductors Aluminum Nitride (AlxNy) Scandium Nitride (ScxNy) Tungsten Nitride (WxNy) Tantalum Nitride (TaxNy)	Carbon Silicon Carbide (SiC) Tantalum carbide (TaCx)	Aluminium Chromium Copper Gold Iron Magnesium Molybdenum Nickel Niobium Palladium Platinum Ruthenium Silver Tantalum Tin Titanium Tungsten Zinc Scandium	AlCu CuTi FeMn MnIr NbTi NiFe NiV alloy TiW alloy (10%/90% by weight) MoSi alloy (50%/50% by At.%) And an electroceramic: YSZ (Yttrium stabilized zirconia) Gd0.2Ce0.8O2 (GCO)	ITO (Tin doped Indium Oxide) AZO (Aluminum doped Zinc Oxide)	SU-8 Antistiction coating Topas PMMA	CrSi bilayer

Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.

Choose deposition equipment

PVD - Physical vapor deposition	LPCVD - low pressure chemical vapor deposition	PECVD - plasma enhanced chemical vapor deposition	ALD - atomic layer deposition	Coaters - for polymers	Others
Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) - Cluster-based multi-chamber high vacuum sputtering deposition system Lesker - Sputter tool Thermal evaporator E-Beam Evaporator (Temescal) E-Beam Evaporator (10 pockets) Sputter coater 03 - Gold sputtering system Sputter coater 04 - Gold sputtering system	Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride Furnace LPCVD Polysilicon (4" and 6") Deposition of polysilicon Furnace LPCVD TEOS (4") - Deposition of silicon oxide	PECVD - Plasma Enhanced Chemical Vapor deposition	ALD1 - Atomic Layer Deposition (thermal) ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)	See the Lithography/Coaters page for coating polymers	MVD - Molecular Vapor Deposition Electroplating of Ni, Cu, Au, etc. - Ask in the department of Mechanical Engineering MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - Ask DTU Electro if you are interested: Elizaveta Semenova or Kresten Yvind