Aligner: Maskless 04

Tool description
The logon password for the PC is "mla" (without quotation marks).

The Aligner: Maskless 04 (µMLA) is a UV exposure tool, which can be used for direct writing of digital mask designs, in photosensitive resists coated on chips, 50 mm, 100 mm, or 150 mm substrates. The aligner has two exposure modes; Raster mode by stepping a write field across the substrate using a DMD and the 365 nm LED source, and Vector mode by direct writing using a focused laser beam from the 405 nm diode laser source.

The µMLA Tabletop Maskless Aligner from Heidelberg, located in PolyFabLab in building 347, is a direct exposure lithography tool installed in 2024. It is a UV exposure system, that exposes the patterns directly on photosensitive resists on chips, 50 mm, 100 mm, or 150 mm substrates, without prior fabrication of a mask. The system offers top side alignment with good accuracy.

Product:	Heidelberg instruments µMLA Tabletop Maskless Aligner
Year of purchase:	2024
Location:	PolyFabLab

Features

Optical Autofocus
Pneumatic Autofocus
Top side Alignment
Gray Scale Exposure
Direct laser writing (vector mode exposure)
DMD projection writing (raster mode exposure)

User manual
The user manual and contact information can be found in LabManager - requires login

Equipment performance and process related parameters

Purpose	Alignment and UV exposure
Exposure modes	Projection (raster mode) Direct laser writing (vector mode)
Exposure light/filters	365 nm (LED) for projection 405 nm (laser diode array) for direct laser writing
Dynamic focusing method	Pneumatic
Minimum resolution	~1 µm
Design file formats	GDS-II CIF DXF Gerber HIMT format
Alignment modes	Top side (TSA): ±1 µm
Substrate size	Maximum writing area: 150 mm x 150 mm Small pieces: 3 mm x 3 mm with optical autofocus 50 mm wafers 100 mm wafers 150 mm wafers
Allowed materials	All PolyFabLab materials with sufficient stiffness and flatness Total height variation across the substrate must be less than ±80 µm - including wafer bow
Substrate batch	1

Process information

Alignment mark design and locations

Alignment mark design and locations.