Overview of wet bench 06 and 07

	Resist Strip	Lift-off
Process	Wet resist strip	Metal lift-off process
Chemical	Remover 1165 (NMP)	Remover 1165 (NMP)
Process temperature	Up to 65°C	Up to 65°C
Substrate batch	1-25 wafers	1-25 wafers
Substrate size	100 mm wafers 150 mm wafers	100 mm wafers 150 mm wafers
Materials allowed	Silicon Silicon oxide Silicon nitride Silicon oxynitride	All metals except Type IV (Pb, Te)