Specific Process Knowledge/Lithography/Development/UV developer

Developer TMAH UV-lithography

Developer: TMAH UV-lithography is located in E-4.

Developer TMAH UV-lithography was released Q4 2014.

Link to information about developer chuck size and hotplate pin positions.

Training video

The user manual, user APV, and contact information can be found in LabManager - requires login

Process Information

• General process information
• Process recommendations
• Standard processes

Equipment performance and process related parameters

Purpose		Development of AZ nLOF AZ MiR 701 AZ 5214E AZ 4562 DUV resists
Developer		AZ 726 MIF (2.38% TMAH in water)
Method	Development	Puddle
	Handling	Vacuum chuck
Process parameters	Temperature	Room temperature
	Agitation	Rotation
	Rinse	DI water
Substrates	Substrate size	100 mm wafers 150 mm wafers
	Allowed materials	Silicon and glass substrates Film or pattern of all except Type IV
	Batch	1-25