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Specific Process Knowledge/Characterization/Sensofar S Neox

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Sensofar S Neox (Optical Profiler)

Unless otherwise stated, all content in this section was done by Berit Herstrøm, DTU Nanolab

Optical Profiler (Sensofar): positioned in the clean room C-1), Photo: DTU Nanolab internal

The Sensofar S Neox 3D Optical Profiler has a sensor head that combines confocal, interferometry and focus variation techniques as well as thick and thin film measurement capabilities.

The Neox sensor head provides standard microscope imaging, confocal imaging, confocal profiling, PSI (Phase Shift Interferometry), CSI (Coherence Scanning Interferometry), Active illumination (Ai) Focus Variation and high resolution thin film thickness measurements on a single instrument.

The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods (i.e. with aspect ratios higher that 1:1), roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution.

For most samples the optical profiler provides fast and easy information without any sample preparation. However, it can be necessary to cover thin transparent layers (< 2 µm) with a thin layer of metal.

The resolution is limited by the objectives and the pixel resolution.

From the Sensofar Metrology, used with permission

Analysis software:

  • Free analysis software for visualizing and analyzing AFM and Optical profiler files (Sensofar) Gwyddion
  • SensoView software from Sensofar can be downloaded from the cleanroom drive :
\CleanroomDrive\_Equipment\Optical profiler Sensofar\
  • We have an extra license to the more advanced SensoMap software. It can be accessed by Remote Desktop: DTU-8CC0321MFL (log-in using your DTU credentials).


The user manual, technical information (SensoSCAN and SensoVIEW manuals) and contact information can be found in LabManager.


Process Information


Performance and Process Parameters

Equipment Optical profiler
Purpose 3D topographic imaging of surfaces.
  • 3D imaging of surfaces
  • Roughness measurements
  • Step height measurements
  • 3D topographic measurements
  • Thick and thin film thickness measurements in small spots
Posibilities Confocal, interferometric and AI focus variation tophography and reflectometry
  • Standard microscope imaging
  • Confocal imaging
  • Confocal profiling
  • PSI (Phase Shift Interferometry)
  • CSI (Coherence Scanning Interferometry)
  • Active illumination (Ai) Focus Variation
  • High resolution thin film thickness measurement using reflectrometry
  • Stitched scans
  • Wafer mapping
From the Sensofar S Neox 3D optical profiler brochure, used with permission
Performance Depending on the objective chosen
  • See the performance of the different objectives here:

Objectives01.JPG

Substrates Substrate size
  • Substrates no bigger than 150 mm x 150mm
Substrate materials allowed
  • In principle all materials as long as they are allowed in the cleanroom outside fumehoods - no liquids!