Aligner: MA6-1

Tool description
The Aligner: MA6-1 is a manual UV exposure system, which can be used for mask alignment and exposure of UV resists on 100 mm substrates. It is also capable of flood exposing chips, 50 mm and 150 mm substrates.

Product:	Süss mask aligner MA6
Year of purchase:	1999
Location:	Cleanroom E-4

User manual
The user manual and contact information can be found in LabManager - requires login

Tool training
Training on the tool requires users to complete the lithography TPT followed by reading the manual and watching the training videos. The tool authorization can be obtained after a successful hands-on authorization training session.

The training videos were made for MA6-2, but operation of MA6-1 is very similar as they are exactly the same model. Due to a different power supply, however, procedures for ignition and intensity control of the lamp is different for MA6-1. Please refer to the manual for the correct procedures.

Operation

Alignment

Equipment performance and process related parameters

Purpose	Alignment and UV exposure
Exposure modes	Vacuum contact Hard contact Soft contact Proximity Flood exposure
Exposure light/filters	365 nm (i-line) broadband (i-, g-, h-lines), requires tool change 303 nm, requires tool change
Minimum resolution	~1.25 µm
Mask size	5x5 inches
Alignment modes	Top side (TSA): ±2 µm Back side (BSA): ±5 µm
Substrate size	Mask exposure and alignment: 100 mm wafers Flood exposure: from samples to 150 mm wafers
Allowed materials	All PolyFabLab allowed materials
Substrate batch	1

Process information

The Aligner: MA6-1 has an i-line notch filter installed. This results in an exposure light peak around 365nm with a FWHM of 7nm.

Exposure dose

Information on UV exposure dose

Alignment mark design and locations

Alignment mark design and locations.