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Specific Process Knowledge/Lithography/Development/manualEbeam developer

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Developer: E-beam 02

 
Developer: E-beam 02 is located in E-4.

Tool description
The Developer: E-beam 02 is a semi-automatic and programmable single substrate developer system, which can be used for development of resists on chips, 50 mm, 100 mm, 150 mm and 200 mm substrates. The development is done using ZED-N50 or AR 600-50 developers and IPA for rinsing.

Single substrates are loaded manually into the tool, but the developer dispense, puddle time, agitation, rinse and drying is controlled by the tool.

Product: Laurell EDC-650Hz-8NPPB-IND
Year of purchase: 2024
Location: Cleanroom E-4

User manual
The user manual and contact information can be found in LabManager - requires login

Tool training
Training on the tool requires users to complete the lithography TPT followed by the online tool training and a hands-on authorization training.
The tool training video is part of the online tool training, but can also be viewed here (the video is for Developer: TMAH Manual 02, but the two tools are almost identical).

Equipment performance and process related parameters

Tool purpose

Development of:

  • AR-P 6200.xx (CSAR)
  • ZEP 520
  • Other E-beam resists
Developer
  • AR 600-50
  • ZED N-50
Development method Puddle
Handling method
  • Non-vacuum chuck for 200 mm wafers
  • Non-vacuum chuck for 100 mm & 150 mm wafers
  • Non-vacuum chuck for 50 mm wafers
  • Non-vacuum chuck for chips
Process temperature Room temperature
Process agitaion 4 cycles per minute
Process rinse IPA
Substrate sizes
  • Chips
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
Substrate materials
  • All cleanroom allowed materials
  • Film, or pattern, of all materials except Type IV
Substrate batch size 1


Process information

All recipes use the following structure:

  1. Pressurize the developer canister
  2. Dispense puddle while rotating substrate slowly
  3. Puddle development with/without agitation of substrate
  4. Spin off developer
  5. Clean substrate with IPA
  6. Dry substrate and chamber with nitrogen


Multi puddle
Multi puddle recipes repeat steps 2-4 for the given number of puddles.

Process recipes

(Updated 2026-01-14, JEHEM)

N50 recipes have the letter "N" in them. AR-600-50 recipes have the letter "A" in them. The number is the development time in seconds:

  • 01 Rinse
  • 02 N 15
  • 03 N 30
  • 04 N 60
  • 05 N 90
  • 06 N 120
  • 07 N 180
  • 08 N 300
  • 09 N 600
  • 10 N 2x60
  • 11 N 5x60
  • 12 A 15
  • 13 A 30
  • 14 A 60
  • 15 A 90
  • 16 A 120
  • 17 A 180
  • 18 A 300
  • 19 A 600
  • 20 A 2x60
  • 21 A 5x60
  • 30 N 3x60s
  • NILT AR
  • NILT MOE
  • NILT p30
  • NILT p31
  • NILT p32

Agitation

4 cycles per minute, 30 rpm, 30 rpm/s.