Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al
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Thermal evaporation of Aluminum
Aluminum can be thermally evaporated at DTU Nanolab in the Thermal Evaporator.
We recommend depositing a thin layer of thermally evaporated aluminum on top of e-beam resist before e-beam lithography. It is also possible to use Cr, see more info here. The advantage of Al is that it can be removed simultaneously with the e-beam resist. However Cr may allow even better resolution of the lithography.
For deposition onto the unexposed e-beam resist, you need to use thermal evaporation as it will be damaged by e-beam evaporation.
Using the Thermal Evaporator
The Thermal Evaporator (Lesker) is easy to use and (without rotation): File:thermal evap wtec vs lesker nano uniformity and particles.pdf
As usual, you need a training session before using the instrument independently.
Time requirements for Al deposition (approx.)
- Vent the chamber (3 min)
- Loading samples and adding Al pellets to the crucible as necessary (5 min)
- Pump down (15-25 min)
- Run the process (soaking/ramping 7 minutes plus time for the deposition rate to stabilize after opening the source shutter, time for the deposition itself and about 1 minute for running down the power afterwards). The deposition rate is 0.5-2 Å/s.
In total set aside at least 45 min PLUS time for the deposition itself.
Quality control (QC) of Al evaporation on the thermal evaporator
| Quality control (QC) for the Thermal evaporator | ||||||||||||||||||
Thicknesses are measured in 5 points with one of the stylus profilers. |

Info about decommissioned equipment (Wordentec)
This file contains some short notes regarding thermal Al evaporation in the Wordentec: Short Tests thermal deposition of Al in Wordentec
Roughness of thermally evaporated aluminium
A study by AFM was performed to examine Al films deposited with thermal evaporation in the Wordentec. See details here.
