Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4

Feedback to this page: click here
Template:CC1

Pegasus 4 - 150mm silicon oxide and silicon nitride etching

The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, Photo: DTU Nanolab internal

The user manual and contact information can be found in LabManager:

DRIE Pegasus 4 in LabManager - requires login

Process information

Standard recipes

• Barc Etch
• SiO2 Etch
• Slow etch of silicon nitride and silicon oxide

Hardware changes

A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.

• Change of showerhead in 2019

Wafer bonding

To find information on how to bond wafers or chips to a carrier wafer, click here.