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Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned

This information is save because it might be valuable as inspiration for other dry etch systems.

Etching using the dry etch technique RIE (Reactive Ion Etch)

RIE2 (part of Cluster2)- positioned in clean room C-1

We had two RIE's. RIE2 for etching silicon based materials, resist and polymers and one (III-V RIE) for etching III-V materials. Here only RIE2 will be described.

In RIE2 it is allowed to have small amounts of metals exposed to the plasma.

The user manuals, quality control procedures and results, user APVs, technical information and contact information can be found in LabManager:

RIE2 info page in LabManager

Process information

Equipment performance and process related parameters

Equipment		RIE1 - HAS BEEN DECOMMISSIONED	RIE2 - HAS BEEN DECOMMISSIONED
Purpose	Dry etch of	Silicon Silicon oxide Silicon (oxy)nitride Resist	Silicon Silicon oxide Silicon (oxy)nitride Resist and other polymers
Performance	Etch rates	Silicon: ~0.04-0.8 µm/min Silicon oxide: ~0.02-0.15 µm/min Silicon (oxy)nitride: ~0.02-? µm/min	Silicon: ~0.04-0.8 µm/min Silicon oxide: ~0.02-0.15 µm/min Silicon (oxy)nitride: ~0.02-? µm/min
Performance	Anisotropy	Can vary from isotropic to anisotropic with vertical sidewalls and on to a physical etch where the sidewalls are angled but without etching under the mask.	Can vary from isotropic to anisotropic with vertical sidewalls and on to a physical etch where the sidewalls are angled but without etching under the mask.
Process parameter range	Max pressure	800 mTorr	949 mTorr
	Max R.F. power	600 W	600 W
	Gas flows	SF₆: 0-52 sccm O₂: 0-99 sccm CHF₃: 0-100 sccm CF₄: 0-42 sccm Ar: 0-146 sccm N₂: 0-100 sccm C₂F₆: 0-24 sccm	SF₆: 0-130 sccm O₂: 0-99 sccm CHF₃: 0-99 sccm CF₄: 0-84 sccm Ar: 0-145 sccm N₂: 0-99 sccm
Substrates	Batch size	1 4" wafer 1 2" wafer (use Al carrier with Si dummy wafer) Several smaller samples (use Al carrier with Si dummy wafer)	1 4" wafer (use Al carrier with Si dummy wafer) 1 2" wafer (use Al carrier with Si dummy wafer) 1 6" wafer (requires 6" setup) Several smaller samples (use Al carrier with Si dummy wafer)
	Allowed materials	Silicon Silicon oxide (with boron, phosphorous and germanium) Silicon nitrides (with boron, phosphorous and germanium) Pure quartz, fused silica (not Pyrex, Tempax and other glasses) Resists: AZ resists, e-beam resists, SU8, DUV resists Aluminium as thin film layer on your sample	Silicon Silicon oxide (with boron, phosphorous and germanium) Silicon nitrides (with boron, phosphorous and germanium) Pure quartz, fused silica (not Pyrex, Tempax and other glasses) Resists: AZ resists, e-beam resists, SU8, DUV resists Other olymers (ask the Plasma group for permission) Aluminium as thin film layer on your sample Other metals (<5% coverage of the wafer)