| Front Image
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Make a mask on your sample
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| Clean your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Wafer cleaning
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Soap Sonic
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Removes dust and particles
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| 7-up & Piranha
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Removes traces of organics and alkali ions
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| RCA
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Two step process to remove traces of organics and metals
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| 5% HF
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Removes native oxide
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| IMEC
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Removing dust, traces of organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
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| Dry your sample Dry your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Wafer and sample drying
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Spin dryers
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Whole wafers
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| Critial point dryer
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Sensitive wafers
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| Ethanol fume drying
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Sensitive wafers
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| N2 blow drying
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N2 pistols
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| Thermal treatment of your sample Thermal treatment of your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Thermal Process
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Annealing (>350C)
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Si, PECVD layers, Al, BCB curing, Polymer
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| Oxidation
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Si wafers
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| Doping with B/P
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Si wafers
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| Pyrolysis
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Resists: AZ, SU8, PDMS
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| Rapid Thermal Anneal (RTP)
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SiO2, Si3N4, Ti, III-V
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Lithography/Baking
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Baking (<300dg)
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baking resist and polymers
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| Make a mask on your sample Make a mask on your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Lithography
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Pattern design & Mask fabrication
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| Photolithography
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UV resists
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| Deep UV lithography
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DUV resists
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| E-beam lithography
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E-beam resists
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| Imprinting
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Polymers
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