Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope
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Process optimization using the Picoscope
Before going into details on why it makes sense to optimize the processes using the picoscope process monitoring, we need to have a look at how this is usually done.
Standard process parameter monitoring
The original standard recipes on Pegasus 1 differ in many ways. The second step of one of them is listed below:
| Process A Step 2 parameters | ||
|---|---|---|
| Parameter | Etch | Dep |
| Gas flow (sccm) | SF6 350 (1.5 s), 550 | C4F8 200 |
| Cycle time (secs) | 7.0 | 4.0 |
| Pressure (mtorr) | 25 (1.5 s), 150 | 25 |
| Coil power (W) | 2800 | 2000 |
| Platen power (W) | 140 (1.5) 45 | 0 |
| Common | Temperature 20 degs | |
When running any recipe on the SPTS Pro software, a set of process parameters are recorded as the process runs. This data can be accessed later by looking up the datalog. Which parameters are recorded is dictated by the socalled logging recipe that is selected for every process recipe. The list of possible parameters to include in a logging recipe is long and is comprised of both input parameters such as 'Coil forward power demand' and 'SF6 flow setpoint', and measured values such as 'Platen temperature' and 'Platen DC Bias'. During the process itself, one can also activate the 'Trace' to monitor the process parameters in real time.
To the left in the figure below, some of the most important process parameters are shown for a process run of the recipe Process A.
- 4 cycles of Process A
Left: Recorded with the SPTS software
Right: Recorded with the Picoscope
Above, one can see the multiplexing of the Bosch process by alternation of the gas flows of SF6 (that has flow initially at 350 sccm in the break for the first 1.5 second then 550 sccm for 5.5 seconds in the main etch phase) and C4F8 (at 200 sccm in the dep phase) according to the process recipe table above. Below, the pressure alternates between 25 mtorr (dep and break) and 150 mtorr (main). The Platen Electrode DC Bias (the electrostatic potential difference between the plasma and the wafer electrode that drives the ion bombardment in the etch process) is generated by the Platen Power at 140 W in the break and 45 W in the main etch. The Reflected Platen Power
Specific_Process_Knowledge/Etch/DRIE-Pegasus/System-description#Why_RF_matching_is_extremely_important_in_the_Bosch_process
- 4 cycles of Process D4
Left: Recorded with the SPTS software
Right: Recorded with the Picoscope
