Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope
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Revision as of 15:17, 17 March 2020 by Jmli (talk | contribs) (→Process optimization using the Picoscope)
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Process optimization using the Picoscope
The original standard recipes on Pegasus 1 differ in many ways. The second step of one of them is listed below:
Process A Step 2 parameters | ||
---|---|---|
Parameter | Etch | Dep |
Gas flow (sccm) | SF6 350 (1.5 s), 550 | C4F8 200 |
Cycle time (secs) | 7.0 | 4.0 |
Pressure (mtorr) | 25 (1.5 s), 150 | 25 |
Coil power (W) | 2800 | 2000 |
Platen power (W) | 140 (1.5) 45 | 0 |
Common | Temperature 20 degs |
When running any recipe on the SPTS Pro software, a set of process parameters are recorded (defined in the logging recipe that can be modified like any other recipe) as the process runs. This data can be accessed later by looking up the datalog. During the process itself, one can also activate the 'Trace' to monitor the process parameters in real time.
- 4 cycles of Process A <span id=
- 4 cycles of Process D4