Specific Process Knowledge/Thin film deposition/thermalevaporator

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Alcatel - A system for deposition of metals

positioned in cleanroom A-1.

The user manual, quality control procedure and results, user APV, technical information and contact information can be found in LabManager:

Alcatel in LabManager

Process information

Materials for e-beam evaporation

• Aluminium (Al)
• Chromium (Cr)
• Copper (Cu)
• Gold (Au)
• Molybdenum (Mo)
• Nickel (Ni)
• Palladium (Pd)
• Platinum (Pt)
• Silver (Ag)
• Tantalum (Ta)
• Tin (Sn)
• Titanium (Ti)
• Tungsten (W) - thinner layers

Equipment performance and process related parameters Alcatel

Purpose	Deposition of metals and silicon	E-beam evaporation of metals Sputtering of Silicon
Performance	Film thickness	10Å - 1µm* (for some materials)
	Deposition rate	2Å/s - 15Å/s
Process parameter range	Process Temperature	Approximately room temperature
	Process pressure	Low than 4*10-6 mbar
Substrates	Batch size	One 4" wafer per run Or several smaller pieces Deposition on one side of the substrate
	Substrate material allowed	Silicon wafers Quartz wafers Pyrex wafers
	Material allowed on the substrate	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar Metals

* For thicknesses above 200 nm permission is requested.