Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace

C4 Furnace Aluminium Anneal

C2 Furnace Anneal Oxide: positioned in cleanroom 2

C2 Furnace Anneal Oxide is a Tempress horizontal furnace for oxidation and annealing of silicon wafers.

This furnace is the second furnace tube in the furnace C-stack positioned in cleanroom 2. The furnaces are the cleanest process chambers in the cleanroom. In this furnace it is allowed to enter wafers that comes directly from PECVD1 (assuming they were very clean when entering PECVD1). Check the cross contamination chart. If you are in doubt, please ask one from the furnace team.

Process knowledge

Oxidation: look at the Oxidation page
Annealing: look at the Annealing page

A rough overview of the performance of Anneal Oxide furnace and some process related parameters

Purpose	Oxidation and annealing	Oxidation: Dry Wet: with bubbler (water steam + N $_{2}$ )
Performance	Film thickness	Dry SiO₂: 10Å to ~2000Å (takes too long to make it thicker) Wet SiO₂: 10Å to ~5µm ((takes too long to make it thicker)
Process parameter range	Process Temperature	800-1150 ^oC
.	Process pressure	1 atm
.	Gas flows	N $_{2}$ :? sccm
Substrates	Batch size	1-30 4" wafer (or 2" wafers) per run
.	Substrate material allowed	Silicon wafers (new from the box or RCA cleaned) with layers of silicon oxide or silicon (oxy)nitride (RCA cleaned) Quartz wafers (RCA cleaned) From PECVD1 directly (assuming they fulfilled the above before entering the PECVD1)