Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy/Workspaces

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Roughness measurements High aspect ratio samples Steep steps - but no high aspect ratio Topographic measurement with no or very small steps (<?)

Comparison method 1 and method 2 for the process

Roughness measurements Topographic measurements with no steep steps Steep steps but no high aspect ratio High aspect ratio measurements
Recommended mode Roughness measurement can be done in both Contact, Tapping and ScanAsyst mode. We recommend ScanAsyst mode because of less chance of (non-uniform) deformation of the sample and less tip wear - and because of ease of use. For Topographic measurements with no steep steps we also recommend ScanAsyst mode due to less chance of (non-uniform) deformation of the sample and less tip wear - and because of ease of use. For Steep steps but no high aspect ratio structures we still recommend ScanAsyst mode but it will go slower than Tapping mode. For High aspect ratio measurements we recommend Tapping mode. There is not yet a ScanAsyst probe developed for high aspect ratio. Therefor we recommend Tapping mode.
Recommended probes ScanAsyst in air ScanAsyst in air ScanAsyst in air for ScanAsyst mode

TAP300Al-G for tapping mode

AR5T-NCH

FIB6

Recommended experiment/Workspace

ScanAsyst in air - roughness (<10nm)

ScanAsyst in air - standards

ScanAsyst in air - steep steps Tapping mode in air 300nm (for steps <~1µm)

Tappping mode in air 6µm (for steps >1~µm)

Substrate size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3