Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy/Workspaces

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Roughness measurements High aspect ratio samples Steep steps - but no high aspect ratio Topographic measurement with no or very small steps (<?)

Comparison method 1 and method 2 for the process

Roughness measurements Topographic measurements with no steep steps Steep steps but no high aspect ratio High aspect ratio measurements
Generel description Generel description - Roughness measurements Generel description -
Recommended probes
  • A
  • B
  • A
  • B
Recommended experiment/Workspace
  • A
  • B
  • C
  • A
Substrate size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3


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