Specific Process Knowledge/Lithography/LiftOff

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Comparing Lift-off equipment

Equipment Lift-off Wet Bench Lift-off (4", 6")
Purpose
  • AZ 5214E lift-off
  • AZ 5214E lift-off
  • AZ nLOF lift-off
Bath chemical

Acetone

NMP (Remover 1165)

Process parameters Process temperature

Room temperature

Heating of the bath is possible.

The heating has been limited to 37°C

Ultrasonic agitation

Continuous

Continuous or pulsed

Substrates Substrate size
  • 100 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials

All cleanroom materials

All cleanroom materials

Batch

1 - 25

1 - 8


Lift-off Wet Bench

Lift-off wet bench in D-3

This bench is only for wafers with metal!

The user manual, and contact information can be found in LabManager


Process information

Here are the main rules for lift-off bench use:

  • Place the wafers in a dedicated wafer holder.
  • Put the holder in the acetone and start the ultrasound. The strip off time is depending of resist thickness.
  • Rinse your wafers for 4-5 min. in running water after stripping.

Find more info about the lift-off process here: Specific Process Knowledge/Photolithography/AZ5214E standard resist - reverse process

Lift-off (4", 6")

Lift-off wet bench in D-3

The user manual, and contact information can be found in LabManager


Process information

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