Specific Process Knowledge/Characterization/Thickness Measurer

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Thickness measurer

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Thickness meassurer. Positioned in cleanroom 4

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.

The user manual, technical information and contact information can be found in LabManager:

Thickness measurer

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The QC procedure The newest QC data The measured standard thickness is 0.1 mm. The measured result have to be within +- 0.005 mm. The QC is preformed ones a year.

Equipment performance and process related parameters

Purpose	Thickness measurer	Wafer Depths of larger grooves Heigth of larger mesas
Performance	Thickness within	0.5 µm
Process parameter range	Process Temperature	Room temperature
	Process pressure	1 atm
Substrates	Batch size	One sample per measure
	Substrate materials allowed	No restriction.

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This is a micrometer-screw.

The Thickness measurer in Cleanroom 3

It measures with an accurracy within a few µm. The range is from a few µm up to 5mm. Measure the wafer in the box next to the meter. If this is ok, then other wafers can be measured. There is a calibration device by the DEKTAK. It is calibrated at 750µm.