Specific Process Knowledge/Characterization/Thickness Measurer

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Thickness measurer

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Thickness meassurer. Positioned in cleanroom 4

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.

The user manual, technical information and contact information can be found in LabManager:

Thickness measurer

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The QC procedure The newest QC data The measured standard thickness is 0.1 mm. The measured result have to be within +- 0.005 mm. The QC is preformed ones a year.

Equipment performance and process related parameters

Purpose	Measurer the thinkness of silicon wafer	??
Performance	??	??
Process parameter range	Process Temperature	800-1150 oC
	Process pressure	1 atm
	Gasses on the system
Substrates	Batch size	1-30 100 mm wafers (or 50 mm wafers) per run
	Substrate materials allowed	Silicon wafers (RCA cleaned) without metal bulk contamination

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This is a micrometer-screw.

The Thickness measurer in Cleanroom 3

It measures with an accurracy within a few µm. The range is from a few µm up to 5mm. Measure the wafer in the box next to the meter. If this is ok, then other wafers can be measured. There is a calibration device by the DEKTAK. It is calibrated at 750µm.