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Thickness measurer

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Thickness meassurer. Positioned in cleanroom 4

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.

The user manual, technical information and contact information can be found in LabManager:

Thickness measurer

Process knowledge

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

QC Recipe:	Wet1050	Dry1050
H₂ flow	3 sccm	0 sccm
O₂ flow	2 sccm	5 sccm
Temperature	1050 C	1050 C
Oxidation time	30 min	100 min

QC limits	Thickness	Non-uniformity (both over a single wafer and over the boat)
Dry1050	110-116 nm	3 %
Wet1050	305-321 nm	5 %

Equipment performance and process related parameters

Purpose	Measurer the thinkness of silicon wafer	??
Performance	??	??
Process parameter range	Process Temperature	800-1150 ^oC
	Process pressure	1 atm
	Gasses on the system
Substrates	Batch size	1-30 100 mm wafers (or 50 mm wafers) per run
Substrates	Substrate materials allowed	Silicon wafers (RCA cleaned) without metal bulk contamination

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This is a micrometer-screw.

It measures with an accurracy within a few µm. The range is from a few µm up to 5mm. Measure the wafer in the box next to the meter. If this is ok, then other wafers can be measured. There is a calibration device by the DEKTAK. It is calibrated at 750µm.