Specific Process Knowledge/Lithography/UVExposure

UV Exposure Comparison Table

Equipment		KS Aligner	EVG Aligner	III-V Aligner	Inclined UV Lamp
Purpose		TS and BS Alignment UV exposure	TS and BS Alignment UV exposure	TS Alignment UV exposure
Performance	Minimum feature size	1.25µm down to 1.0µm	1.25µm
	Exposure light/filters/spectrum	350W Hg-lamp, 365nm filter, 303nm filter optional intensity in Constant Intensity(CI) mode 7mJ/cm2	350W Hg-lamp, SU8 filter, 365nm filter optional intensity in Constant Intensity(CI) mode 7mJ/cm2
	Exposure mode	proximity, soft, hard, vacuum contact	proximity, soft, hard, vacuum contact proximity, soft, hard, vacuum contact
Process parameter range	Positive Process
Process parameter range	Negative Process
Substrates	Batch size	1 small samples 1 50 mm wafers 1 100 mm wafers 1 150 mm wafers	1 50 mm wafers 1 100 mm wafers 25 150 mm wafers with automatic handling	1 small samples 1 50 mm wafers 1 100 mm wafers 1 150 mm wafers
	Allowed materials	Si and silicon oxide, silicon nitride Quartz, pyrex	Si and silicon oxide, silicon nitride Quartz, pyrex	III-V compounds

KS Aligner

SUSS Mask Aligner MA6 is designed for high resolution photolithography. The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, hard, soft, proximity) are supplied. Two alignment options are available: top side alignment (TSA) with a split field or a video microscope and back side alignment (BSA) with BSA microscope. It is also possible to make IR- light alignment.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager

EVG Aligner

Aligner-6inch EVG620 is placed in Cleanroom 13.

EVG620 aligner is designed for high resolution photolithography. The machine can be used for 2, 4 and 6 inch substrates. Cassette-to-cassette handling option is available only for 6inch substrates. The automatic pattern recognition software is available for the special alignment marks design recommended of EVGroup. Please contact Danchip staff for further information. Available exposure mode: proximity, soft, hard and vacuum contact. Two alignment options are available: top side alignment (TSA) and back side alignment (BSA). IR-light alignment also an option.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager

III-V Aligner

The SÜSS MicroTec MA1006 mask aligner located in the III-V cleanroom is dedicated for processing of III-V compound semiconductors.

Specific use of the mask aligner can be found in the standard resist recipes.

Performance	substrate size	small pieces 1x1 cm up to 2inch"
	Exposure mode	soft contact, hard contact, proximity, flood exposure
	Exposure light/filters	365 nm, 405 nm
	Minimum structure size	~1µm
	Mask size	5x5inch
	Alignment modes	Top side only

Inclined UV lamp

The Inclined UV lamp is 1000 W Hg(Xe)lamp source designed for near UV, 350-450nm, mid UV, 260-320nm, and deep UV, 220-260nm exposures of resists and polymers. The exposure source can be also used to make an inclined exposure in air or in the media tank.

The toll was purchased in February 2009 from Newport company. The exposure lamp has a official name: Oriel Flood Exposure Source, unit 92540. All other parts of equipment: substrate and mask holder with media tank, exhaust box around the tool, timer controller, were designed and build at Danchip workshop.

The substrate and mask holder with a media tank was designed as part of Master Thesis of DTU Nanotech, Andres Kristensen group. The exhaust box was made as part of safety and the timer controller was build to control exposure time.

The technical specification and the general outline of the equipment can be found in LabManager.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager