Specific Process Knowledge/Lithography/UVExposure

UV Exposure Comparison Table

Equipment		KS Aligner	EVG Aligner	III-V Aligner	Inclined UV Lamp
Purpose		Spinning and baking of AZ5214E resist Spinning and baking of AZ4562 resist Spinning and baking of e-beam resist	Spinning and baking of AZ5214E resist Spinning and baking of AZ4562 resist Spinning and baking of SU8 resist	In-line substrate HMDS priming Coating and baking of AZ MiR 701 (29cps) resist Coating and baking of AZ nLOF 2020 resist Post-exposure baking at 110°C
Performance	Substrate handling	Cassette-to-cassette Edge handling chuck	Single substrate Non-vacuum chuck for fragile substrates	Cassette-to-cassette	Single substrate
	Permanent media	AZ5214E resist AZ4562 resist Acetone for chuck cleaning Acetone for drip pan	AZ5214E resist PGMEA for edge bead removal Acetone for chuck cleaning	AZ MiR 701 (29cps) resist AZ nLOF 2020 resist PGMEA for backside rinse and edge-bead removal PGMEA for spinner bowl cleaning and vapor tip bath
	Manual dispense option	2 automatic syringes	yes pneumatic dispense for SU8 resist	no
Process parameter range	Spindle speed	Range	Range	10 - 9990 rpm	10-5000 rpm
Process parameter range	Parameter 2	Range	Range	Range
Substrates	Batch size	24 50 mm wafers 24 100 mm wafers 24 150 mm wafers	1 100 mm wafer 1 150 mm wafer	25 100 mm wafers	Maximum substrate size: 6" Minimum substrate size: 3*3 mm2 maximum substrate thickness: 4 mm
	Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3	Silicon Glass	III-V compound semiconductors Si, SiO2, SOI

KS Aligner

SUSS Mask Aligner MA6 is designed for high resolution photolithography. The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, hard, soft, proximity) are supplied. Two alignment options are available: top side alignment (TSA) with a split field or a video microscope and back side alignment (BSA) with BSA microscope. It is also possible to make IR- light alignment.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager

EVG Aligner

Aligner-6inch EVG620 is placed in Cleanroom 13.

EVG620 aligner is designed for high resolution photolithography. The machine can be used for 2, 4 and 6 inch substrates. Cassette-to-cassette handling option is available only for 6inch substrates. The automatic pattern recognition software is available for the special alignment marks design recommended of EVGroup. Please contact Danchip staff for further information. Available exposure mode: proximity, soft, hard and vacuum contact. Two alignment options are available: top side alignment (TSA) and back side alignment (BSA). IR-light alignment also an option.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager

III-V Aligner

Inclined UV lamp

The Inclined UV lamp is 1000 W Hg(Xe)lamp source designed for near UV, 350-450nm, mid UV, 260-320nm, and deep UV, 220-260nm exposures of resists and polymers. The exposure source can be also used to make an inclined exposure in air or in the media tank.

The toll was purchased in February 2009 from Newport company. The exposure lamp has a official name: Oriel Flood Exposure Source, unit 92540. All other parts of equipment: substrate and mask holder with media tank, exhaust box around the tool, timer controller, were designed and build at Danchip workshop.

The substrate and mask holder with a media tank was designed as part of Master Thesis of DTU Nanotech, Andres Kristensen group. The exhaust box was made as part of safety and the timer controller was build to control exposure time.

The technical specification and the general outline of the equipment can be found in LabManager.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager