Specific Process Knowledge/Thermal Process

Choose a process type

A1 Bor Drive-in furnace - For oxidation and annealing of Si wafers and for drive-in after boron pre-dep
A2 Bor Pre-dep furnace - For pre-deposition (doping) of boron on Si wafers
A3 Phosphor Drive-in furnace - For oxidation and annealing of Si wafers and for drive-in after phosphorus pre-dep
A4 Phosphor Pre-dep furnace - For pre-deposition (doping) of phosphorus on Si wafers
C1 Furnace Anneal-oxide - For oxidation and annealing of 100 mm and 150 mm wafers
C2 Gate Oxide furnace - For gate oxide growing on new wafers
C3 Anneal-bond furnace - For oxidation and annealing of bonded wafers
C4 Aluminium Anneal furnace - For oxidation and annealing of wafers containing aluminium
Furnace Noble - For annealing and oxidation of non-clean wafers
Furnace APOX - For growing of very thick oxide layers
Jipelec RTP - For rapid thermal annealing of III-V materials and Si based materials
BCB Curing Oven - For resist curing and metal alloying
Resist Pyrolysis Furnace - For pyrolysis of different resist layers