Specific Process Knowledge/Lithography/Baking

From LabAdviser

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Comparing baking methods

Spray coater hotplate SU-8 hotplates 1, 2 & 3 Small benchtop hotplates Gamma hotplates Oven: 110C - 250C Oven 250C
Purpose

Adjustable temperature, contact bake

  • Soft bake
  • PEB
  • Hard bake

Programmable, ramped contact bake

  • Soft bake of SU-8
  • PEB of SU-8

Hotplate: 90-110C:
Programmable, contact bake

  • Soft bake
  • PEB


Labspin hotplates:
Adjustable temperature, contact bake

  • Soft bake
  • PEB
  • Hard bake

Recipe dependent temperature, contact or proximity bake

  • Soft bake
  • PEB
  • Hard bake

Manual convection bake

  • Hard bake
  • Post-exposure bake

Manual convection bake

  • Dehydration
  • NO resist!
Temperature

Maximum 180°C

Temperature with top-plate: Actual surface temperature = 0.9 * display value

Maximum 110°C

Hotplate: 90-110C:

  • Maximum 120°C
  • Return to 90°C after use


Labspin hotplates:

  • Maximum temperature is hotplate dependent
  • Temperature with top-plate: Actual surface temperature = 0.9 * display value

Fixed at various recipe dependent temperatures

110 - 250°C

Return to 110°C after use

Fixed at 250°C

Substrate size
  • Pieces
  • 50 mm wafer
  • 100 mm wafer
  • 150 mm wafer
  • 200 mm wafer
  • pieces
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafer
  • 200 mm wafer
  • pieces (only Labspin hotplates)
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafer
  • 200 mm wafer
  • 100 mm wafers
  • 150 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials

All substrates

Film or pattern of all types

Silicon, glass, and polymer substrates

Film or pattern of all types except type IV

Hotplate dependent.

(All substrates and film or pattern of all types, unless otherwise noted on the hotplate)

Silicon and glass substrates

Silicon, glass, and high Tg polymer substrates

Film or pattern of all types

Silicon, glass, and high Tg polymer substrates

Film or pattern of all types except resist|

Restrictions
(Not allowed)
III-V, copper, steel substrates

Pb, Te films

Hotplate dependent. Any restrictions will be noted on the hotplate.

III-V, low Tg polymer, copper, steel substrates III-V, low Tg polymer, copper, steel substrates

Resist is not allowed

QC
- requires login

https://labmanager.dtu.dk/view_binary.php?type=data&mach=293

Hotplate 1:
https://labmanager.dtu.dk/view_binary.php?type=data&mach=122

Hotplate 2:
https://labmanager.dtu.dk/view_binary.php?type=data&mach=124

Hotplate 3:
https://labmanager.dtu.dk/view_binary.php?type=data&mach=453

Hotplate: 90-110C:
https://labmanager.dtu.dk/view_binary.php?type=data&mach=336

Spin coater: Labspin 02:
https://labmanager.dtu.dk/view_binary.php?type=data&mach=362

Spin coater: Labspin 03:
https://labmanager.dtu.dk/view_binary.php?type=data&mach=387

Spincoater: Gamma ebeam & UV:
http://labmanager.dtu.dk/view_binary.php?fileId=4431

Spincoater: Gamma UV:
http://labmanager.dtu.dk/view_binary.php?fileId=4432

Developer: TMAH UV-lithography:
http://labmanager.dtu.dk/view_binary.php?fileId=4434

Spincoater: Süss stepper:
http://labmanager.dtu.dk/view_binary.php?fileId=4433

Developer: Stepper:
http://labmanager.dtu.dk/view_binary.php?fileId=4435




Hotplates

Hotplate: 90-110C

Hotplate: 90-110C located in C-1

Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.


The user manual, and contact information can be found in LabManager:

Hotplate: 90-110C - requires login


SU-8 hotplates 1, 2 & 3

Hotplate 1 (SU8) and Hotplate 2 (SU8) situated in C-1

We have three dedicated SU-8 hotplates in C-1 and E-4.

Users can control the ramp-time, the baking temperature, and the baking time. In order to avoid thermal curing of SU-8 residues on the hotplates, they are temperature limited to 180°C.


The user manual, and contact information can be found in LabManager:

Hotplate 1 (SU8) - requires login

Hotplate 2 (SU8) - requires login

Hotplate 3 (SU8) - requires login

Small benchtop hotplates

Model: Präzitherm PZ 28-2.

Contact bake only. Maximum temperature is hotplate dependent.

Most of these hotplates have been fitted with a top-plate in order to protect the original hotplate surface. With the top-plate, the set point of the controller must be adjusted in order to achieve the correct temperature during the bake:

Actual surface temperature = 0.9 * display value


Gamma hotplates

Hotplate modules in Spin Coater: Gamma UV.

Hotplate temperatures are recipe dependent.

Information about the Süss MicroTec Gamma tools can be found in labadviser:


Ovens

Oven: 110C - 250C

Oven: 110C - 250C situated in C-1

Variable temperature convection oven mostly used for baking of wafers as a hard baking step after development of photoresist.

The set-point can be varied, but should always be returned to 110°C after use.


The user manual, and contact information can be found in LabManager:

Oven: 110C - 250C - requires login

Oven 250C for pretreatment

Oven 250C for pretreatment situated in C-1

See Oven 250C