Specific Process Knowledge/Back-end processing/FlexScribe

From LabAdviser
< Specific Process Knowledge‎ | Back-end processing
Revision as of 14:41, 31 March 2020 by Rkch (talk | contribs) (Created page with "The Cleaver: FlexScribe is designed for cleaving large wafers into smaller pieces from the frontside. Hence it will leave particles on the frontside of the sample. It works by...")
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)

The Cleaver: FlexScribe is designed for cleaving large wafers into smaller pieces from the frontside. Hence it will leave particles on the frontside of the sample. It works by running a "pizza wheel" over the sample and then breaking it in two by using a pair of pliers. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: Flex Scribe should always be placed inside Fume hood 5.

Approved Materials:

  • Si
  • Quartz
  • Pyrex (Borofloat 33)
  • GaAs
  • InP
  • Sapphire

The Flex Scribe can cleave samples from 100mm down to ~10mm, please contact wetchemistry group for more information

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/FlexScribe&oldid=35299"