Specific Process Knowledge/Back-end processing/FlexScribe

From LabAdviser
Jump to navigation Jump to search

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

The Cleaver: FlexScribe

The Cleaver: FlexScribe is a scriber designed for cleaving/scribing large wafers into smaller pieces from the frontside. Hence it will leave particles on the frontside of the sample. It works by running a "pizza wheel" over the sample and then breaking it in two by using a pair of pliers.

The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: Flex Scribe should always be placed inside Fume hood 5.

Flexscribe.JPG

Approved Materials:

  • Si
  • Quartz
  • Pyrex (Borofloat 33)
  • GaAs
  • InP
  • Sapphire

The Flex Scribe can cleave samples from 150mm down to ~10mm, please contact wetchemistry group for more information

DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the FlipScribe and the LatticeAxe for more information.

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/FlexScribe&oldid=43713"